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CSBTS GB ICS List 中国国家標準(GB,GB/T規格)
ICS(国際規格分類)コード別一覧
 ICS 31:エレクトロニクス 分野


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ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.080 L40 GB/T 249-1989 半导体分立器件型号命名方法 The rule of type designation for discrete semiconductor devices  
31.100 L35 GB/T 787-1974 电子管管基尺寸 Dimensions of electronic tube bases  
31.180 L30 GB/T 1360-1998 印制电路网格体系 Grid systems for printed circuits IDT IEC 60097:1991
31.020 L10 GB/T 1772-1979 电子元器件失效率试验方法 Determination of failure rate of electronic elements and components  
31.180 L30 GB/T 2036-1994 印制电路术语 Terms for printed circuits NEQ IEC 60194-88
31.030 L32 GB/T 2413-1980 压电陶瓷材料体积密度测量方法 Piezoelectric ceramic materials--Measuring methods for determination of volume density  
31.030 L90 GB/T 2414.1-1998 压电陶瓷材料性能试验方法 圆片径向伸缩振动模式 Test methods for the properties of piezoelectric ceramics Radial extension vibration mode for disk  
31.030 L90 GB/T 2414.2-1998 压电陶瓷材料性能试验方法 长条横向长度伸缩振动模式 Test methods for the properties of piezoelectric ceramics Transverse length extension vibration mode for bar  
31.020 L11 GB/T 2470-1995 电子设备用固定电阻器、固定电容器型号命名方 Type designation system for fixed resistors and fixed capacitors for use in electronic equipment  
31.020 L13 GB/T 2471-1995 电阻器和电容器优先数系 Preferred number series for resistors and capacitors IDT IEC 60063-1963
31.020 L05 GB/T 2689.1-1981 恒定应力寿命试验和加速寿命试验方法总则 Constant stress life tests and acceleration life tests--General rules  
31.020 L05 GB/T 2689.2-1981 寿命试验和加速寿命试验的图估计法 (用于威布尔分布) Life test and acceleration life test charts--Evaluation of their Weibull distributons  
31.020 L05 GB/T 2689.3-1981 寿命试验和加速寿命试验的简单线性无偏估计法 (用于威布尔分布) Life test and acceleration life test--Simple linear deflection-free--Evaluation of Weibull distributions  
31.020 L05 GB/T 2689.4-1981 寿命试验和加速寿命试验的最好线性无偏估计法 (用于威布尔分布) Life test and acceleration life test--Optimal linear deflection-free--Evaluation of Weibull distributions  
31.020 L04 GB/T 2691-1994 电阻器和电容器的标志代码 Marking codes for resistors and capacitors IDT IEC 60062-92
31.060.10 L11 GB/T 2693-2001 电子设备用固定电容器 第1部分: 总规范 Fixed capacitors for use in electronic equipment Part 1: Generic specitigation IDT IEC 60384-1:1999
31.020 L22 GB/T 2775-1993 手控电子元件的轴端尺寸 Dimensions of spendle ends for manually operated electronic components EQV IEC 60390A-1976
31.100 L35 GB/T 2987-1996 电子管参数符号 Letter symbols of parameter for electronic tubes  
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.240 K05 GB/T 3047.1-1995 高度进制为20mm的面板、架和柜的基本尺寸系列 Series of basic dimensions of panels, rack and cabinets for vertical increment of 20mm  
31.240 L89 GB/T 3047.2-1992 高度进制为44.45mm 的面板、机架和机柜的基本尺寸系列 Series of basic dimensions of panels, racks and enclosures for vertical increment of 44.45mm  
31.240 K05 GB/T 3047.3-1989 高度进制为20mm的插箱、插件基本尺寸系列 20mm increment's basic dimension series for subracks and subassemblies  
31.240 L89 GB/T 3047.4-1986 高度进制为44.45mm 的插箱、插件的基本尺寸系列 Series of basic dimensions of subracks and plug-in units for vertical increment of 44.45mm NEQ IEC 60297-3
31.240 K05 GB/T 3047.5-1989 高度进制为20mm的台式机箱基本尺寸系列 20mm increment's basic dimensions series for cabiners  
31.240 L89 GB/T 3047.6-1986 电子设备台式机箱基本尺寸系列 Series of basic dimensions of cases for electronic equipment  
31.240 L94 GB/T 3047.8-1996 高度进制为44.45mm的窄柜基本尺寸系列 Series of basic dimension of narrow cabinets for vertical increment of 44.45mm  
31.100 L35 GB/T 3188-1982 电子管外形尺寸 Outline dimensions of electrnic tubes  
31.100 L35 GB/T 3189-1982 电子管引出帽连接尺寸 Connecting dimensions for caps of electronic tubes NEQ IEC 60067
31.120 L38 GB/T 3212-1982 K白电视显象管测试方法 The methods of the measurement of the black and-white television picture tubes  
31.100 L39 GB/T 3213-1994 闸流管与充气整流管测试方法 Methods of measurement for thyratrons and gas-filled rectifier tubes  
31.060.20 Y20 GB/T 3295-1996 陶瓷制品45°镜向光泽度试验方法 Standard test method for 45°specular gloss of ceramic ware NEQ ASTM C 346-1976
31.100 L36 GB/T 3306-2001 小功率电子管电性能测试方法 Measurements of the electrical properties of low-power electronic tubes  
31.100 L36 GB/T 3307-1982 小功率电子管灯丝断续试验方法 Method of heater intermittent test of low-poewr electronic tubes  
31.020 L18 GB/T 3351-1982 人造石英晶体的型号命名 Designations for synthetic quartz crystals  
31.020 L90 GB/T 3352-1994 人造石英晶体 Synthetic quartz crystal  
31.020 L90 GB/T 3353-1995 人造石英晶体使用指南 Guide to the use of synthetic quartz crystal EQV IEC 60758-1993
31.030 L18 GB/T 3388-1982 压电陶瓷材料型号命名方法 Designations for types of piezoelectric ceramics  
31.030 L90 GB/T 3389.1-1996 铁电压电陶瓷词汇 Vocabulary for ferroelectric and piezoelectric ceramics  
31.030 L90 GB/T 3389.2-1999 压电陶瓷材料性能测试方法 纵向压电应变常数d33的静态测试 Test methods for the properties of piezoelectric ceramics-- Static test for piezoelectric strain constant d33  
31.030 L90 GB/T 3389.3-2001 压电陶瓷材料性能试验方法 居里温度Tc的测试 Test methods for the properties of piezoelectric ceramics test for Curie temperature Tc  
31.030 L18 GB/T 3389.4-1982 压电陶瓷材料性能测试方法 柱体纵向长度伸缩振动模式 Test methods for the properties of piezoelectric ceramics--Longitudinal length extension vibration mode for rod  
31.030 L90 GB/T 3389.5-1995 压电陶瓷材料性能测试方法 圆片厚度伸缩振动模式 Test methods for the properties of piezoelectric ceramics--Thickness extension vibration mode for disk NEQ IEC 60483
31.030 L90 GB/T 3389.6-1997 压电陶瓷材料性能测试方法 长方片厚度切变振动模式 Test methods for properties of piezoelectric ceramics--Thickness-shear vibration mode for rectangular plate  
31.030 L18 GB/T 3389.7-1986 压电陶瓷材料性能测试方法 强场介电性能的测试 Test methods for the properties of piezoelectric ceramics--Test for dielectric properties in high electric field  
31.030 L18 GB/T 3389.8-1986 压电陶瓷材料性能测试方法 热释电系数的测试 Test methods for the properties of piezoelectric ceramics--Test for the pyroelectric coefficient  
31.200 L55 GB/T 3430-1989 半导体集成电路型号命名方法 The rule of type designation for semiconductor integrated circuits  
31.200 L56 GB/T 3431.2-1986 半导体集成电路文字符号 引出端功能符号 Letter symbols for semiconductor integrated circuits--Letter symbols for function of pins  
31.200 L56 GB/T 3432.4-1989 半导体集成电路TTL电路系列和品种 54/74LS系列的品种 Series and products for TTL semiconductor integrated circuits - Products of series 54/74 LS  
31.200 L56 GB/T 3434-1986 半导体集成电路ECL电路系列和品种 Families and products of ECL circuits for semiconductor integrated circuits  
31.200 L56 GB/T 3435-1987 半导体集成CMOS电路系列和品种 4000系列的品种 Series and products for semiconductor CMOS integrated circuits--Products of families 4000  
31.020;
33.
L04 GB/T 3482-1983 电子设备雷击试验方法 Lightning test for electronic equipments  
31.020;
33.
L04 GB/T 3483-1983 电子设备雷击试验导则 Guidance for lightning test for electronic equipments  
31.030;
71.
H65 GB/T 3503-1993 氧化钇 Yttrium oxide  
31.030;71. H65 GB/T 3504-1992 荧光级氧化铕 Europium oxide phosphor grade  
31.060.70 K42 GB 3667-1997 交流电动机电容器 A.C. motor capacitors IDT IEC 60252:1992
31.060 L11 GB/T 3788-1995 真空电容器通用技术条件 General specification for vacuum capacitors NEQ MIL-C-23183
31.100 L35 GB/T 3789.1-1991 发射管电性能测试方法 总则 Measurements of the electrical properties of transmitting tubes - General  
31.100 L35 GB/T 3789.2-1991 发射管电性能测试方法 阳极电流和栅极电流的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of current of anode and grid  
31.100 L35 GB/T 3789.3-1991 发射管电性能测试方法 阴极发射电流的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of cathode emission current  
31.100 L35 GB/T 3789.4-1991 发射管电性能测试方法 栅极反向电流的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of reverse grids current  
31.100 L35 GB/T 3789.5-1991 发射管电性能测试方法 栅极热放射电流的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of grid thermo-emission current  
31.100 L35 GB/T 3789.6-1991 发射管电性能测试方法 跨导、放大系数的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of transconductance and amplification factor  
31.100 L35 GB/T 3789.7-1991 发射管电性能测试方法 阳极离子流的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of anode ion current  
31.100 L35 GB/T 3789.8-1991 发射管电性能测试方法 阳极最大耗散功率和阳极过载耗散功率的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of maximum anode dissipation power and anode overload dissipation power  
31.100 L35 GB/T 3789.9-1991 发射管电性能测试方法 栅极最大耗散功率的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of maximum grid dissipation power  
31.100 L35 GB/T 3789.10-1991 发射管电性能测试方法 第一栅极截止电压的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of grid No1 cut-off voltage  
31.100 L35 GB/T 3789.11-1991 发射管电性能测试方法 第三栅极截止电压的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of grid No3 cut-off voltage  
31.100 L35 GB/T 3789.12-1991 发射管电性能测试方法 极间绝缘的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of interelectrode insulation  
31.100 L35 GB/T 3789.13-1991 发射管电性能测试方法 共栅电路静态特性曲线的测试方法 Measurements of the electrical properties of transmitting tubes? Methods of measurements of static characteristic curve for common grid circuit  
31.100 L35 GB/T 3789.14-1991 发射管电性能测试方法 共阴电路静态特性曲线的测试方法 Measurements of the electrical properties of transmitting tubes?Measuring methods of static characteristic curve for common cathode circuit  
31.100 L35 GB/T 3789.15-1991 发射管电性能测试方法 输出功率的测试方法 Measurements of the electrical properties of transmitting tubes?Measuring methods of output power  
31.100 L35 GB/T 3789.16-1991 发射管电性能测试方法 脉冲输出功率的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of pulse output power  
31.100 L35 GB/T 3789.17-1991 发射管电性能测试方法 电气强度的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of electrical intensity  
31.100 L35 GB/T 3789.18-1991 发射管电性能测试方法 电极间绝缘体高频损耗的测试方法 Measurements of the electrical properties of transmitting tubes ? Measuring methods of high frequency loss for interelectrode insulators  
31.100 L35 GB/T 3789.19-1991 发射管电性能测试方法 频率特性曲线的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of frequency characteristic curve  
31.100 L35 GB/T 3789.20-1991 发射管电性能测试方法 第一栅极电流截止电压的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of grid No1 current cut-off voltage  
31.100 L35 GB/T 3789.21-1991 发射管电性能测试方法 静态特性参考点的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of static characteristic reference point  
31.100 L35 GB/T 3789.22-1991 发射管电性能测试方法 振动稳定性的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of vibration stability  
31.100 L35 GB/T 3789.23-1991 发射管电性能测试方法 第三栅极控制能力的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of grid No3 control ability  
31.100 L35 GB/T 3789.24-1991 发射管电性能测试方法 线性放大管双音互调失真的测试方法 Measurements of the electrical properties of transmitting tubes - Measuring methods of dual tone inter-modulation distortion of linear amplifier tubes  
31.100 L35 GB/T 3789.25-1991 发射管电性能测试方法 图象输出功率的测试方法 Measurements of the electrical properties of transmitting tubes - Methods of measuring the vision output power  
31.100 L35 GB/T 3789.26-1991 发射管电性能测试方法 功率揄v的测试方法 Measurements of the electrical properties of transmitting tubes - Methods of measuring the power gain  
31.100 L35 GB/T 3789.27-1991 发射管电性能测试方法 三音互调失真的测试方法 Measurements of the electrical properties of transmitting tubes - Methods of measuring the inter-modulation distortion of a three tone signal  
31.100 L35 GB/T 3789.29-1991 发射管电性能测试方法 低频亮度非线性的测试方法 Measurements of the electrical properties of transmitting tubes - Method of measuring the non-linearity in the luminance of the lower frequency  
31.100 L35 GB/T 3789.30-1991 发射管电性能测试方法 由亮度信号不同引起的色度信号失真 (微分揄vDG和微分相位DP) 的测试方法 Measurements of the electrical properties of transmitting tubes?Methods of measuring the distortion in the chrominance signal due to the luminance (differential gain and dfferential phgase)  
31.100 L35 GB/T 3789.31-1991 发射管电性能测试方法 同步脉冲压缩的测试方法 Measurements of the electrical properties of trausmitting tubes - Methods of measuring the press of synchronizing pluse  
31.120 L39 GB/T 3790-1995 荧光显示管测试方法 Methods of measurement for fluorescent display tubes  
31.100 L35 GB/T 3789.28-1991 发射管电性能测试方法 交叉调制的测试方法 Measurements of the electrical properties of transmitting tubes - Method of measuring the cross modulation  
31.120 L38 GB/T 3951-1983 液晶显示器件型号命名方法 The rule of type designation of liquid crystal display devices  
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.080.10 L41 GB/T 4023-1997 半导体器件 分立器件和集成电路 第2部分: 整流二极管 Semiconductor devices--Discrete devices and integrated circuits--Part 2: Rectifier diodes EQV IEC 60747-2:1983
31.030 L90 GB/T 4070-1996 荧光粉性能试验方法 Test methods for properties of phosphors  
31.030 L32 GB/T 4071-1983 光致荧光粉测试方法 Measuring method for the phosphor excited by light  
31.030 L32 GB/T 4072-1983 阴极射线致荧光粉测试方法 Measuring method of the phosphor excited by cathod rays  
31.030 L90 GB/T 4073-1996 荧光粉牌号 Type of phosphor  
31.060.60 L11 GB/T 4165-1984 电子设备用可变电容器的使用导则 Guide to the use of variable capacitors in electronic equipment EQV IEC 60612-78
31.060.60 L11 GB/T 4166-1984 电子设备用可变电容器的试验方法 Methods of test of variable capacitors in electronic equipment EQV IEC 60418-1-81
31.030 L90 GB/T 4181-1997 钨丝 Tungsten wires  
31.030 L90 GB/T 4182-1997 钼丝 Molybdenum wires  
31.030 L90 GB/T 4314-2000 吸气剂术语 Getter terms  
31.200 L56 GB/T 4376-1994 半导体集成电路 电压调整器系列和品种 Series and products of voltage regulators for semiconductor integrated circuits  
31.200 L56 GB/T 4377-1996 半导体集成电路 电压调整器测试方法的基本原理 Semiconductor integrated circuits--General principles of measuring methods of voltage regulator  
31.020 L15 GB/T 4475-1995 敏感元器件术语 Terms of sensor  
31.080 L42 GB/T 4586-1994 半导体器件 分立器件 第8部分: 场效应晶体管 Semiconductor devices--Discrete devices--Part 8: Field-effect transistors IDT IEC 60747-8-84
31.080 L42 GB/T 4587-1994 半导体分立器件和集成电路 第7部分: 双极型晶体管 Semiconductor discrete devices and integrated circuits--Part 7: Bipolar transistors IDT IEC 60747-7-88
31.180 L30 GB/T 4588.1-1996 无金属化孔单双面印制板分规范 Sectional specification:single and double sided printed boards with plain holes IDT IEC/PQC 89-1990
31.180 L30 GB/T 4588.2-1996 有金属化孔单双面印制板分规范 Sectional specification:single and double sided printed boards with plated-through holes IDT IEC/PQC 90-90
31.180 L30 GB/T 4588.3-1988 印制电路板设计和使用 Design and use of printed boards NEQ IEC 60326-3-80
31.180 L30 GB/T 4588.4-1996 多层印制板 分规范 Seetional spocification--Multilayer printed boards IDT IEC/PQC 91-1990
31.180 L30 GB/T 4588.10-1995 印制板 第10部分: 有贯穿连接的刚挠双面印制板规范 Printed boards--Part 10: Specification for flex-rigid double-sided printed boards with through connections IDT IEC 60326-10-91
31.180 L30 GB/T 4588.12-2000 预制内层层压板规范(半制成多层印制板) Specification for mass lamination panels (semi-manufactured multilayer printed boards) IDT IEC 60326-12:1991
31.080 L40 GB/T 4589.1-1989 半导体器件 分立器件和集成电路总规范 (可供认证用) Semiconductor devices - Generic specification for discrete devices and integrated circuits IDT IEC 60747-10-84
31.100 L35 GB/T 4597-1996 电子管词汇 Vocabulary of electronic tubes  
31.120 L49 GB/T 4619-1996 液晶显示器件测试方法 Measuring methods for liquid crystal display devices  
31.180 L30 GB/T 4677.1-1984 印制板表层绝缘电阻测试方法 Test method of surface insulation resistance for printed boards NEQ IEC 60326-2-76
31.180 L30 GB/T 4677.2-1984 印制板金属化孔镀层厚度测试方法 微电阻法 Micro-resistance test method of plating thickness of platedthrough holes for printed boards NEQ IPC TM-650
31.180 L30 GB/T 4677.3-1984 印制板拉脱强度测试方法 Test methods of pull strength for printed boards NEQ IEC 60326-2-76
31.180 L30 GB/T 4677.4-1984 印制板抗剥强度测试方法 Test methods of peel strength for printed boards NEQ IEC 60326-2-76
31.180 L30 GB/T 4677.5-1984 印制板翘曲度测试方法 Test methods of platness for printed boards NEQ IPC D-300
31.180 L30 GB/T 4677.6-1984 金属和氧化覆盖层厚度测试方法 截面金相法 Test methods for thickness of metal and oxide coating by microscopical examination of cross-section EQV ISO 1463-73
31.180 L30 GB/T 4677.7-1984 印制板镀层附着力试验方法 胶带法 Test method of plating adhesion by adhesive type for printed boards NEQ IPC A 600B
31.180 L30 GB/T 4677.8-1984 印制板镀涂覆层厚度测试方法 β反向散射法 Test method of plating and coating thickness by beta backscattering for printed boards NEQ ANSI/ASTM B567-79
31.180 L30 GB/T 4677.9-1984 印制板镀层孔隙率电图象测试方法 The electrographic test method of plating porosity for printed boards NEQ IEC 60326-2-76
31.180 L30 GB/T 4677.10-1984 印制板可焊性测试方法 Test method of solderability for printed boards NEQ IEC 60068-2-20C
31.180 L30 GB/T 4677.11-1984 印制板耐热冲击试验方法 Test methods of thermal shock for printed boards NEQ IEC 60326-2-76
31.180 L30 GB/T 4677.12-1988 印制板互连电阻测试方法 Test method of interconnection resistance for printed boards EQV IEC 60326-2-76
31.180 L30 GB/T 4677.13-1988 印制板金属化孔电阻的变化 热循环测试方法 Test method of change in resistance of plated-through holes--Thermal cycling for printed boards EQV IEC 60326-2A-80
31.180 L30 GB/T 4677.14-1988 印制板蒸汽-氧气加速老化试验方法 Test method of steam/oxygen accelerated ageing of printed board EQV IEC 60326-2A-80
31.180 L30 GB/T 4677.15-1988 印制板绝缘涂层耐溶剂和耐焊剂试验方法 Test method for solvent and flux resistance of insulating coating on printed boards EQV IEC 60326-2-76
31.180 L30 GB/T 4677.16-1988 印制板一般检验方法 General examination method for printed boards  
31.180 L30 GB/T 4677.17-1988 多层印制板内层绝缘电阻测试方法 Test method for insulation resistance within inner layers of multilayer printed boards EQV IEC 60326-2-76
31.180 L30 GB/T 4677.18-1988 多层印制板层间绝缘电阻测试方法 Test method for insulation resistance between layers of multilayer printed boards EQV IEC 60326-2-76
31.180 L30 GB/T 4677.19-1988 印制板电路完善性测试方法 Test method for electrical integrity of printed boards  
31.180 L30 GB/T 4677.20-1988 印制板镀层附着性试验方法 摩擦法 Test method for plating adhesion of printed boards--Burnishing EQV IEC 60326-2-76
31.180 L30 GB/T 4677.21-1988 印制板镀层孔隙率测试方法 气体暴露法 Test method for plating porosity of printed boards--The gas exposure method  
31.180 L30 GB/T 4677.22-1988 印制板表面离子污染测试方法 Test method for surface ionic contamination of printedboards  
31.180 L30 GB/T 4677.23-1988 印制板阻燃性能测试方法 Test method for flammability of printed boards EQV IEC 60326-2-76
31.180 L30 GB/T 4721-1992 印制电路用覆铜箔层压板通用规则 General rules for copper-clad laminated sheets for printed circuits NEQ IEC 60249-85~88
31.180 L30 GB/T 4722-1992 印制电路用覆铜箔层压板试验方法 Test methods for copper-clad laminated sheets for printed circuits NEQ IEC 60249-1-82
31.180 L30 GB/T 4723-1992 印制电路用覆铜箔酚醛纸层压板 Phenolic cellulose paper copper-clad laminated sheets for printed circuits NEQ IEC 60249-2-85~88
31.180 L30 GB/T 4724-1992 印制电路用覆铜箔环氧纸层压板 Epoxide cellulose paper copper-clad laminated sheets for printed circuits NEQ IEC 60249-2-87
31.180 L30 GB/T 4725-1992 印制电路用覆铜箔环氧玻璃布层压板 Epoxide woven glass fabric copper-clad laminated sheets for printed circuits NEQ IEC 60249-2-87
31.030 L32 GB/T 4779.1-1984 彩色显象管用荧光粉Y22-G3荧光粉 Phosphors for color picture tubes use--Phosphor Y22-G3  
31.030 L32 GB/T 4779.2-1984 彩色显象管用荧光粉Y22-B2荧光粉 Phosphors for color picture tubes use--Phosphor Y22-B2  
31.030 L32 GB/T 4779.3-1984 彩色显象管用荧光粉Y22-R4荧光粉 Phosphors for color picture tubes use--Phosphor Y22-R4  
31.060 K42 GB/T 4787-1996 断路器电容器 Circuit-breaker capacitors  
31.260 L51 GB/T 4799-2001 激光器型号命名方法 The type designation for laseres  
31.180 L30 GB/T 4825.1-1984 印制板导线局部放电测试方法 Test method for partial discharge of conductors on printed boards NEQ IEC 60512-2
31.180 L30 GB/T 4825.2-1984 印制板导线载流量测试方法 Test method for current carrying capacity of conductors on printed boards EQV ANSI C83.59
31.200 L56 GB/T 4855-1984 半导体集成电路线性放大器系列和品种 Families and products of linear amplifier for semiconductor integrated circuits  
31.060.30 L11 GB/T 4874-1985 直流固定金属化纸介电容器总规范 Generic specification for fixed metallized paper dielectric capacitors for direct current  
31.260 L51 GB/T 4931-2000 氦氖激光器系列型谱 The series and type spectrum for helium neon lasers  
31.260 L51 GB/T 4932-2000 二氧化碳激光器系列型谱 The series and type spectrum for carbon dioxide lasers  
31.080 L40 GB/T 4937-1995 半导体器件机械和气候试验方法 Mechanical and climatic test methods for semiconductor devices IDT IEC 60749-84
31.020 L35 GB/T 4965-1985 吸气剂分类及型号命名方法 Classification and designation for getter  
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.020 L10 GB/T 5076-1985 具有两个轴向引出端的圆柱体元件的尺寸测量 Measurement of the dimensions of a cylindrical component having two axial terminations EQV IEC 60294-69
31.020 L10 GB/T 5077-1985 电容器和电阻器的最大外形尺寸 Maximum case dimensions for capacitors and resistors EQV IEC 60451-74
31.020 L10 GB/T 5078-1985 单向引出的电容器和电阻器所需空间的测定方法 Method for the determination of the space required by capacitors and resistors with unidirectional terminations EQV IEC 60717-81
31.020 L05 GB/T 5081-1985 电子产品现场工作可靠性、有效性和维修性数据收集指南 Guide for the collection of reliability,availability and maintainability data from field performance of electronic items IDT IEC 60362-71
31.220 L23 GB/T 5095.1-1997 电子设备用机电元件 基本试验规程及测量方法 第1部分: 总则 Electromechanical components for electronic equipment Basic testing procedures and measuring methods--Part 1: General IDT IEC 60512-1:1994
31.220 L23 GB/T 5095.2-1997 电子设备用机电元件 基本试验规程及测量方法 第2部分: 一般检查、电连续性和接触电阻测试、绝缘试验和电压应力试验 Electromechanical components for electronic equipment Basic testing procedures and measuring methods--Part 2: General examination,electrical continuity and contact resistance tests,insulation tests and voltage stress tests IDT IEC 60512-2:1994
31.220 L23 GB/T 5095.3-1997 电子设备用机电元件 基本试验规程及测量方法 第3部分: 载流容量试验 Electromechanical components for electronic equipment Basic testing procedures and measuring methods--Part 3: Current-carrying capacity tests IDT IEC 60512-3:1976
31.220 L23 GB/T 5095.4-1997 电子设备用机电元件 基本试验规程及测量方法 第4部分: 动态应力试验 Electromechanical components for electronic equipment Basic testing procedures and measuring methods--Part 4: Dynamic stress tests IDT IEC 60512-4:1976
31.220 L23 GB/T 5095.5-1997 电子设备用机电元件 基本试验规程及测量方法 第5部分: 撞击试验(自由元件)、静负荷试验(固定元件)、寿命试验和过负荷试验 Electromechanical components for electronic equipment--Basic testing procedures and measuring methods--Part 5: Impact tests(free components),static load test(fixed components),endurance tests and overload tests IDT IEC 60512.5:1992
31.220 L23 GB/T 5095.6-1997 电子设备用机电元件 基本试验规程及测量方法 第6部分: 气候试验和锡焊试验 Electromechanical components for electronic equipment Basic testing procedures and measuring methods--Part 6: Climatic tests and soldering tests IDT IEC 60512-6:1984
31.220 L23 GB/T 5095.7-1997 电子设备用机电元件 基本试验规程及测量方法 第7部分: 机械操作试验和密封性试验 Electromechanical components for electronic equipment Basic testing procedures and measuring methods--Part 7: Mechanical operating tests and sealing tests IDT IEC 60512-7:1993
31.220 L23 GB/T 5095.8-1997 电子设备用机电元件 基本试验规程及测量方法 第8部分: 连接器、接触件及引出端的机械试验 Electromechanical components for electronic equipment--Basic testing procedures and measuring methods--Part 8: Connector tests(mechanical) and mechanical tests on contacts and terminations IDT IEC 60512-8:1993
31.220 L23 GB/T 5095.9-1997 电子设备用机电元件 基本试验规程及测量方法 第9部分: 杂项试验 Electromechanical components for electronic equipment--Basic testing procedures and measuring methods--Part 9: Miscellaneous tests IDT IEC 60512-9:1992
31.220 L23 GB/T 5095.11-1997 电子设备用机电元件 基本试验规程及测量方法 第11部分: 气候试验 Electromechanical components for electronic equipment--Basic testing procedures and measuring methods-Part 11: Climatic tests IDT IEC 60512-11-1:1995
31.220 L23 GB/T 5095.12-1997 电子设备用机电元件 基本试验规程及测量方法 第12部分: 锡焊试验第六篇: 试验12f-在机器焊接中封焊处耐焊剂和清洁剂 Electromechanical components for electronic equipment--Basic testing procedures and measuring methods-Part 12: Soldering tests-Section 6: Test 12f--Sealing against flux and cleaning solvents in machine soldering IDT IEC 60512-12-6-1996
31.220 L23 GB/T 5095.15-1997 电子设备用机电元件 基本试验规程及测量方法 第15部分: 接触件和引出端的机械试验 第八篇: 试验15h-接触件固定机构耐工具使用性 Electromechanical components for electronic equipment--Basic testing procedures and measuring methods-Part 15: Mechanical tests on contacts and terminations--Section 8: Test 15h--Contact retention system resistance to tool application IDT IEC 60512-15-8-1995
31.260 L39 GB/T 5295-1985 光电阴极光谱响应特性系列 The spectral response characteristic series of photocathodes  
31.260 Y40 GB 5296.3-1995 消费品使用说明 化妆品通用标签 Instructions for use of products--Generel labelling of cosmetics  
31.180 L30 GB/T 5489-1985 印制板制图 Printed board drawing  
31.030 C90 GB/T 5593-1996 电子元器件结构陶瓷材料 Structure ceramic materials used in electronic components  
31.030;
31.
L32 GB/T 5594.1-1985 电子元器件结构陶瓷材料性能测试方法 气密性测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for gas-tightness  
31.030;
31.
L32 GB/T 5594.2-1985 电子元器件结构陶瓷材料性能测试方法 杨氏弹性模量、泊松比测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for Youngs elastic modulus and Poisson ratio  
31.030;
31.
L32 GB/T 5594.3-1985 电子元器件结构陶瓷材料性能测试方法 平均线膨胀系数测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for mean coefficient of linear expansion  
31.030;
31.
L32 GB/T 5594.4-1985 电子元器件结构陶瓷材料性能测试方法 介质损耗角正切值的测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for dielectric loss angle tangent value  
31.030;
31.
L32 GB/T 5594.5-1985 电子元器件结构陶瓷材料性能测试方法 体积电阻率测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for volume resistivity  
31.030;
31.
L32 GB/T 5594.6-1985 电子元器件结构陶瓷材料性能测试方法 化学稳定性测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for chemical durability  
31.030;
31.
L32 GB/T 5594.7-1985 电子元器件结构陶瓷材料性能测试方法 透液性测定方法 Test methods for properties of structure ceramic used in electronic components--Test method for liquid permeability  
31.030;
31.
L32 GB/T 5594.8-1985 电子元器件结构陶瓷材料性能测试方法 显微结构的测定 Test methods for properties of structure ceramic used in electronic components--Determination of microstructure  
31.030 L90 GB/T 5596-1996 电容器用陶瓷介质材料 Ceramic dielectric materials used for capacitors  
31.030 L90 GB/T 5597-1999 固体电介质微波复介电常数的测试方法 Test method for complex permittivity of solid dielectric materials at microwave frequencies  
31.040.10 L13 GB/T 5729-1994 电子设备用固定电阻器 第一部分: 总规范 Fixed resistors for use in electronic equipment--Part 1: Generic specification IDT IEC 60115-1-82
31.040.10 L13 GB/T 5730-1985 电子设备用固定电阻器第二部分: 分规范: 低功率非线绕固定电阻器 (可供认证用) Fixed resistors for use in electronic equipment--Part 2: Sectional specification: Fixed low-power nonwire wound resistors IDT IEC 60115-2-82
31.040.10 L13 GB/T 5731-1985 电子设备用固定电阻器 第二部分: 空白详细规范: 低功率非线绕固定电阻器评定水平E (可供认证用) Fixed resistors for use in electronic equipment--Part 2: Blank detail specification: Fixed low-power non-wirewound resistors--Assessment level E IDT IEC 60115-2-1-82
31.040.10 L13 GB/T 5732-1985 电子设备用固定电阻器 第四部分: 分规范: 功率型固定电阻器(可供认证用) Fixed resistors for use in electronic equipment--Part 4: Sectional specification: Fixed power resistors IDT IEC 60115-4-82
31.040.10 L13 GB/T 5733-1985 电子设备用固定电阻器 第四部分: 空白详细规范: 功率型固定电阻器 评定水平E (可供认证用) Fixed resistors for use in electronic equipment--Part 4: Blank detail specification: Fixed power resistors Assessment level E IDT IEC 60115-4-1-83
31.040.10 L13 GB/T 5734-1985 电子设备用固定电阻器 第五部分: 分规范: 精密固定电阻器 (可供认证用) Fixed resistors for use in electronic equipment--Part 5: Sectional specification: Fixed precision resistors IDT IEC 60115-5-82
31.040.10 L13 GB/T 5735-1985 电子设备用固定电阻器 第五部分: 空白详细规范: 精密固定电阻器 评定水平E (可供认证用) Fixed resistors for use in electronic equipment--Part 5: Blank detail specification: Fixed precision resistors--Assessment level E IDT IEC 60115-5-1-83
31.030 L32 GB/T 5838-1986 荧光粉名词术语 Terms for phosphors  
31.020 L04 GB/T 5839-1986 电子管和半导体器件额定值制 Rating systems for electronic tubes and semiconductor devices IDT IEC 60134-61
31.100 L39 GB/T 5960-1986 阴极射线管总规范(可供认证用) Generic specification for cathode ray tubes  
31.120 L38 GB/T 5961-1986 彩色显象管空白详细规范(可供认证用) Blank detail specification for colour picture tubes  
31.200 L56 GB/T 5965-2000 半导体器件 集成电路 第2部分: 数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 Semiconductor devices--Integrated circuits--Part 2: Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) IDT IEC 60748-2-1:1991
31.060.10 L11 GB/T 5966-1996 电子设备用固定电容器 第8部分: 分规范: 1类瓷介固定电容器 Fixed capacitors for use in electronic equipment--Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, class 1 IDT IEC 60384-8-1988
31.060.10 L11 GB/T 5967-1996 电子设备用固定电容器 第8部分: 空白详细规范 1类瓷介固定电容器 评定水平E Fixed capacitors for use in electronic equipment--Part 8: Blank detail specification Fixed capacitors of ceramic dielectric, class 1--Assessment level E IDT IEC 60384-8-1-1988
31.060.20 L11 GB/T 5968-1996 电子设备用固定电容器 第9部分: 分规范 2类瓷介固定电容器 Fixed capacitors for use in electronic equipment--Part 9: Sectional specification Fixed capacitors of ceramic dielectric, class 2 IDT IEC 60384-9-1988
31.060.20 L11 GB/T 5969-1996 电子设备用固定电容器 第9部分: 空白详细规范 2类瓷介电容器 评定水平 E Fixed capacitors for use in electronic equipment--Part 9: Blank detail specification Fixed capacitor of ceramic dielectric, class 2 --Assessment level E IDT IEC 60384-9-1-1988
31.060.50 L11 GB/T 5993-1986 电子设备用固定电容器 第四部分: 分规范 固体和非固体电解质铝电容器(可供认证用) Fixed capacitors for use in electronic equipment--Part 4: Sectional specification--Aluminium electrolytic capacitors with solid and non-solid electrolyte IDT IEC 60384-4-85
31.060.50 L11 GB/T 5994-1986 电子设备用固定电容器 第四部分: 空白详细规范 非固体电解质铝电容器 评定水平 E (可供认证用) Fixed capacitors for use in electronic equipment--Part 4: Blank detail specification--Aluminium electrolytic capacitors with non-solid electrolyte--Assessment level E IDT IEC 60384-4-1-85
31.120 L38 GB/T 5998-1994 彩色显象管测试方法 Methods of measurement of colour picture tubes  
31.120 L38 GB/T 5999-1986 示波管和指示管测试方法 Methods of measurement of oscilloscope tubes and indicator tubes  
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.060 K42 GB/T 6115.1-1998 电力系统用串联电容器 第1部分: 总则 性能、试验和额定值 安全要求 安全导则 Series capacitors for power systems Part 1: General--Performance,testing and rating--Safety requirements--Guide for installation EQV IEC 60143-1:1992
310.030 N05 GB/T 6145-1999 锰铜、康铜精密电阻合金线、片及带 Manganin and constantan alloy wires,sheet and rolled wires for precision electrical resistance  
31.120 L38 GB/T 6206-1986 K白显象管空白详细规范 (可供认证用) Blank detail specification for black and white picture tubes NEQ CECC 11001
31.120 L38 GB/T 6207-1986 示波管和指示管空白详细规范 (可供认证用) Blank detail specification for oscilloscope tubes and indicator tubes IDT CECC 11001
31.080.30 L42 GB/T 6217-1998 半导体器件 分立器件 第7部分: 双极型晶体管 第一篇 高低频放大环境额定的双极型晶体管空白详细规范 Semiconductor Devices Discrete devices Part 7: Bipolar transistors Section One-Blank detail specification for ambient-rated bipolar transistors for low and high frequency amplification IDT IEC 60747-7-1:1989
31.080.30 L42 GB/T 6218-1996 开关用双极型晶体管空白详细规范 Blank detail specification for bipolar transistors for switching applications IDT IEC 60747-7-3-1991
31.080.30 L42 GB/T 6219-1998 半导体器件 分立器件 第8部分: 场效应晶体管 第一篇 1GHz、5W以下的单栅场效应晶体管 空白详细规范 Semiconductor devices Discrete devices Part 8: Field-effect transistors Section One-Blank detail specification for singe-gate field-effect transistors up to 5W and 1GHz IDT IEC 60747-8-1:1987
31.120 L38 GB/T 6250-1986 液晶显示器件名词术语 Terms for liquid crystal displays  
31.120 L38 GB/T 6251-1986 液晶显示器件外形尺寸标注及引线排布规则 Dimensionsing of outline and rule of terminals alignment for liquid crystal displays  
31.060.60 L11 GB/T 6252-1986 电子设备用A类调谐可变电容器类型规范 Type specification for variable tuning capacitors--Type A in electronic equipments EQV IEC 60418-2-76
31.060.60 L11 GB/T 6253-1986 电子设备用B类微调可变电容器类型规范 Type specification for variable trimmer capacitors--Type B in electronic equipments EQV IEC 60418-3-76
31.060.60 L11 GB/T 6254-1986 电子设备用C类预调可变电容器类型规范 Type specification for variable preset capacitors--Type C in electronic equipments EQV IEC 60418-4-76
31.100 L36 GB/T 6255-2001 空间电荷控制电子管总规范 General specification for space-charge controlled tubes  
31.080.30 L42 GB/T 6256-1986 工业加热三极管空白详细规范 (可供认证用) Blank detail specification for industrial heating triodes  
31.100 L36 GB/T 6257-1986 阳极耗散功率不大于1kW 的小功率发射管空白详细规范 (可供认证用) Blank detail specification for small power transmitting tubes of anode dissipation up to 1kW  
31.100 L38 GB/T 6258-1986 盘封电子管空白详细规范 Blank detail specification for disk seal power tubes  
31.060.20 L11 GB/T 6261-1998 电子设备用固定电容器 第五部分: 分规范 额定电压不超过3000伏的直流云母介质固定电容器试验方法的选择和一般要求 Fixed capacitors for use in electronic equipment Part 5: Sectional specification Fixed mica dielectric d.c.capacitors with a rated voltage not exceeding 3000V Selection of methods of test and general requirements IDT IEC 60384-5:1993
31.060.20 L11 GB/T 6262-1998 电子设备用固定电容 第五部分: 空白详细规范 额定电压不超过3000伏的直流云母介质固定电容器 评定水平E Fixed capacitors for use in electronic equipment Part 5: Blank detail specification Fixed mica dielectric d.c.capacitors with a rated voltage not exceeding 3000V Assessment level E IDT IEC 60384-5-1:1993
31.060.30 L11 GB/T 6346-1986 电子设备用固定电容器 第11部分: 分规范: 金属箔式聚乙烯对苯二甲酸乙二醇酯膜介质直流固定电容器 (可供认证用) Fixed capacitors for use in electronic equipment--Part 11: Sectional specification: Fixed polyethylene-terephthalate film dielectric metal foil D.C.capacitors IDT IEC TC 40(CO)612-85:FDIS
31.060.30 L11 GB/T 6347-1986 电子设备用固定电容器 第11部分: 空白详细规范: 金属箔式聚乙烯对苯二甲酸乙二醇酯膜介质直流固定电容器 评定水平 E(可供认证用) Fixed capacitors for use in electronic equipment--Part 11: Blank detail specification: Fixed polyethylene-terephthalate film dielectric metal foil D.C. capacitors--Assessment level E IDT IEC TC 40(CO)613-85:FDIS
31.080.10 L43 GB/T 6351-1998 半导体器件 分立器件 第2部分: 整流二极管 第一篇 100A以下环境或管壳额定整流二极管(包括雪崩整流二极管)空白详细规范 Semiconductor devices Discrete devices Part 2: Rectifier diodes Section One-Blank detail specification for rectifier diodes(including avalanche recti-fier diodes)1, ambient and case-rated,up to 100A IDT IEC 60747-2-1:1989
31.080.20 L43 GB/T 6352-1998 半导体器件 分立器件 第6部分: 闸流晶体管 第一篇 100A以下环境或管壳额定反向阻断三极闸流晶体管空白详细规范 Semiconductor devices Discrete devices Part 6: Thyristors Section One-Blank detail specification for reverse blocking triode thyristors,ambient or case-rated,up to 100A IDT IEC 60747-6-1:1989
31.260 N33 GB/T 6360-1995 激光功率能量测试仪器规范 Specification for laser radiation power and energy measuring equipment EQV IEC 61040-1990
31.030 L90 GB/T 6426-1999 铁电陶瓷材料电滞回线的准静态测试方法 Quasi-static test method for ferroelectric hysteresis loop of ferroelectric ceramics  
31.030 L90 GB/T 6427-1999 压电陶瓷振子频率温度稳定性的测试方法 Test method for freguency temperature stability of piezoelectric ceramic vibrator  
31.080.20 L39 GB/T 6428-1995 氢闸流管测试方法 Methods of the measurement for hydrogen thyratron tubes NEQ IEC 60151-20
31.140 L21 GB/T 6429-1986 石英谐振器型号命名方法 The rule of type designation for quartz crystal units  
31.140 L21 GB/T 6430-1986 晶体盒型号命名方法 The rule of type designation for crystal holders (enclosures)  
31.240 L89 GB/T 6431-1986 通信设备条形机架基本尺寸 Basic dimensions of narrow frame used for telecommunication equipment  
31.080.10 L41 GB/T 6570-1986 微波二极管测试方法 Measuring methods for microwave diodes NEQ IEC 60147-2-78
31.080.10 L42 GB/T 6571-1995 半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 Semiconductor devices--Discrete devices--Part 3: Signal(including switching)and regulator diodes IDT IEC 60747-3-1985
31.080.10 L41 GB/T 6588-2000 半导体器件 分立器件 第3部分: 信号(包括开关)和调整二极管 第一篇 信号二极管、开关二极管和可控雪崩二极管空白详细规范 Semiconductor devices Discrete devices Part 3: Signal(including switching) and regulator diodes Section One--Blank detail specification for signal diodes,switching diodes and controlled-avalanche diodes EQV IEC 60747-3-1:1986
31.080.10 L41 GB/T 6589-1986 电压调整和电压基准二极管 (包括温度补尝精密基准二极管) 空白详细规范 (可供认证用) Blank detail specification for volt age regulator diodes and voltage reference diodes, excluding temperature compensated precision reference diodes EQV IEC TC47 (CO)897-83:FDIS
31.080.20 L43 GB/T 6590-1998 半导体器件 分立器件 第6部分: 闸流晶体管 第二篇 100A以下环境或管壳额定的双向三极闸流晶体管空白详细规范 Semiconductor devices Discrete devices Part 6: Thyristors Section Two-Blank detail specification for bidirectional triode thyristors(triacs),ambient or case-rated,up to 100A IDT IEC 60747-6-2:1991
31.030;
31.
L32 GB/T 6625-1986 掺氮吸气剂含氮量测试方法 Test methods for nitrogen content of nitrogen-doped getter  
31.030;
31.
L32 GB/T 6626.1-1986 释汞吸气剂性能测试方法 释汞吸气剂释汞特性的测试方法 Test methods for the characteristics of getter-mercury dispenser--Test methods for mercury yield characteristic of getter-mercury dispenser  
31.030;
31.
L32 GB/T 6626.2-1986 释汞吸气剂性能测试方法 释汞吸气剂含汞量的测试方法 Test methods for the characteristics of getter-mercury dispenser--Test method for mercury content of getter-mercury dispenser  
31.030;
31.
L32 GB/T 6626.3-1986 释汞吸气剂性能测试方法 释汞吸气剂放气量的测试方法 Test methods for the characteristics of getter-mercury dispenser--Test method for gas emission of getter mercury dispenser  
31.030;
31.
L32 GB/T 6626.4-1986 释汞吸气剂性能测试方法 释汞吸气剂压粉牢固度的检验方法 Test methods for the characteristics of getter-mercury dispenser--Method for peel off test of getter-mercury dispenser  
31.030 L90 GB/T 6628-1996 人造石英晶体制材 Lumbered synthetic quartz crystal NEQ IEC 60758-1993
31.200 L56 GB/T 6648-1986 半导体集成电路静态读/ 写存储器空白详细规范(可供认证用) Blank detail specification for semiconductor integrated circuit static read/write memories NEQ IEC TC 47/SC 47A(CO)988-85:FDIS
31.040.30 L15 GB/T 6663-1986 直热式负温度系数热敏电阻器总规范 (可供认证用) General specification for the directly heated negative temperature coefficient thermistors NEQ IEC 60539-76
31.040.30 L15 GB/T 6664-1986 直热式负温度系数热敏电阻器空白详细规范 评定水平E(可供认证用) Blank detail specification for directly heated negative temperature coefficient thermistors--Assessment level E NEQ IEC 60738-1-1-82
31.200 L56 GB/T 6798-1996 半导体集成电路 电压比较器测试方法的基本原理 Semiconductor integrated circuits--General principles of measuring methods of voltage comparators  
31.200 L56 GB/T 6800-1986 半导体集成音响电路音频功率放大器测试方法的基本原理 General principles of measuring methods of audio power amplifiers for semicomductor audio integrated circuits  
31.200 L56 GB/T 6812-1986 半导体集成非线性电路系列和品种 模拟乘- 除法器的品种 Families and variety of semiconductor integrated non-linear circuits variety of analog multipliers-dividers  
31.200 L56 GB/T 6813-1986 半导体集成非线性电路系列和品种 时基电路的品种 Families and variety of semiconductor integrated non-linear circuits Variety of timers  
31.200 L56 GB/T 6814-1986 半导体集成非线性电路系列和品种 模拟开关的品种 Families and variety of semiconductor integrated non-linear circuits variety of analog switch  
31.200 L56 GB/T 6815-1986 半导体集成非线性电路系列和品种 锁相环的品种 Families and variety of semiconductor integrated non-linear circuits Variety of phase-locked loop  
31.060.70 K48 GB/T 6915-1986 高原电力电容器 Power capacitors for high altitude districts  
31.060.70 K42 GB/T 6916-1997 湿热带电力电容器 Power capacitors for damp tropics  
31.020 L05 GB/T 6990-1986 电子设备用元器件(或部件)规范中可靠性条款的编写指南 Guide for the inclusion of reliability clauses into specifications for components (or parts) for electronic equipment IDT IEC 60409-81
31.020 L05 GB/T 6993-1986 系统和设备研制生产中的可靠性程序 Reliability procedure for system and equipment development and production NEQ MIL STD 78513
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.040.10 L13 GB/T 7016-1986 固定电阻器电流噪声测量方法 Method of measurement of current noise generated in fixed resistors IDT IEC 60195-65
31.040 L13 GB/T 7017-1986 电阻器非线性测量方法 Method of measurement of non-linearity in resistors IDT IEC 60440-73
31.200 L55 GB/T 7092-1993 半导体集成电路外形尺寸 Outline dimensions of semiconductor integrated circuits  
31.040.30 L15 GB/T 7153-1987 直热式阶跃型正温度系数热敏电阻器总规范 (可供认证用) Generic specification for the directly heated positive step-function temperature coefficient thermistors EQV IEC 60738-1-82
31.040.30 L15 GB/T 7154-1987 直热式阶跃型正温度系数热敏电阻器空白详细规范 评定水平E (可供认证用) Blank detail specification for the directly heated positive step-function temperature coefficient thermistors--Assessement level E EQV IEC 60738-1-1-82
31.060.40 L11 GB/T 7213-1987 电子设备用固定电容器第十五部分: 分规范 非固体或固体电解质钽电容器 (可供认证用) Fixed capacitors for use in electronic equipment--Part 15: Sectional specification--Fixed tantalum capacitors with non-solid or solid electrolyte EQV IEC 60384-15-84
31.060.40 L11 GB/T 7214-1987 电子设备用固定电容器 第十五部分: 空白详细规范 固体定电解质和多孔阳极钽电容器 评定水平 E (可供认证用) Fixed capacitors for use in electronic equipment--Part 15: Blank detail specification--Fixed tantalum capacitors with solid electrolyte and porous anode--Assessment level E EQV IEC 60384-15-1-84
31.260 N33 GB 7247.1-2001 激光产品的安全 第1部分: 设备分类、要求和用户指南 Safety of laser products Part 1: Equipment classification,requirements and user's guide IDT IEC 60825-1:l993
31.260 L39 GB/T 7257-1987 氦氖激光器参数测试方法 Measurement methods of parameter for helium neon laser  
31.260 L39 GB/T 7270-1987 光电倍搖ヌ测试方法 Methods of measurement for photomultiplier tubes NEQ IEC 60306-69
31.260 L39 GB/T 7271-1987 光电管测试方法 Methods of measurement for phototubes NEQ IEC 60306-69
31.100 L35 GB/T 7274-1987 电子管极间电容测试方法 Methods for the measurement of direct interelectrode capacitances of electronic tubes and valves NEQ IEC 60100-62
31.060.30 L11 GB/T 7332-1996 电子设备用固定电容器 第2部分: 分规范: 金属化聚乙烯对苯二甲酸酯膜介质 直流固定电容器 Fixed capacitors for use in electronic equipment--Part 2: Sectional specification--Fixed metallized polyethylene-terephthalate film dielectric d.c.capacitors IDT IEC 60384-2-1982
31.060.30 L11 GB/T 7333-1996 电子设备用固定电容器 第2部分: 空白详细规范 金属化聚乙烯对苯二甲酸酯膜介质 直流固定电容器 评定水平E Fixed capacitors for use in electronic equipment--Part 2: Blank detail specification--Fixed metallized polyethylene-terephthalate film dielectric d.c.capacitors--Assessment level E IDT IEC 60384-2-1-1982
31.040.10 L13 GB/T 7338-1996 电子设备用固定电阻器 第6部分: 分规范各电阻器可单独测量的固定电阻网络 Fixed resistors for use in electronic equipment--Part 6: Sectional specification--Fixed resistor networks with individually measurable resistors IDT IEC 60115-6-1987
31.040.10 L13 GB/T 7339-1987 电子设备用固定电阻器 第六部分: 空白详细规范: 阻值和功耗相同, 各电阻器可单独测量的固定电阻网络 评定水平 E (可供认证用) Fixed resistors for use in electronic equipment--Part 6: Blank detail specification--Fixed resistor networks with individually measurable resistors, all of equalvalue and equal dissipation--Assessment level E IDT IEC 60115-6-1-83
31.040.10 L13 GB/T 7340-1987 电子设备用固定电阻器 第六部分: 空白详细规范: 阻值和功耗不同, 各电阻器可单独测量的固定电阻网络 评定水平 E (可供认证用) Part 6: Blank detail specification--Fixed resistor networks with individually measurable resistor of either different resistance values or different rated dissipations--Assessment level E IDT IEC 60115-6-2-83
31.160 K04 GB/T 7343-1987 10kHz - 30MHz无源无线电干扰滤波器和抑制元件抑制特性的测量方法 Methods of measurement of the suppresion characteristics of passive radio interference filters and suppression components over the frequency range of 10kHz to30MHz  
31.240 L32 GB/T 7423.1-1987 半导体器件散热器 通用技术条件 Heat sink of semiconductor devices--Generic specification  
31.240 L32 GB/T 7423.2-1987 半导体器件散热器 型材散热器 Heat sink of smiconductor devices--Heat sink, extruded shapes  
31.240 L32 GB/T 7423.3-1987 半导体器件散热器 叉指形散热器 Heat sink of semiconductor devices--Heat sink, Staggered fingers shapes  
31.080.30 L42 GB/T 7576-1998 半导体器件 分立器件 第7部分: 双极型晶体管 第四篇 高频放大管壳额定双极型晶体管空白详细规范 Semiconductor devices Discrete devices Part 7: Bipolar transistors Section Four-Blank detail specification for case-rated bipolar transistors for high-frequency amplification IDT IEC 60747-7-4:1991
31.080.30 L42 GB/T 7577-1996 低频放大管壳额定的双极型晶体管空白详细规范 Blank detail specification for case-rated bipolar transistors for low-frequency amplification IDT IEC 60747-7-2-1989
31.080 L42 GB/T 7581-1987 半导体分立器件外形尺寸 Dimensions of outlines for semiconductor discrete devices NEQ IEC 60191-2-74
31.180 L30 GB/T 7613.1-1987 印制板导线耐电流试验方法 Test method for current proof of conductors on printed boards  
31.180 L30 GB/T 7613.2-1987 印制板表层耐电压试验方法 Test methods for voltage proof of surface layers on printed boards  
31.180 L30 GB/T 7613.3-1987 印制板金属化孔耐电流试验方法 Test methods for current proof of plated-through holes on printed boards  
31.060.60 K43 GB/T 7675-1987 交流高压断路器的开合电容器组试验 The capacitor banks switching tests for A.C.high-voltage circuit-breaker EQV IEC 60056-78
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.080 K46 GB/T 8446.1-1987 电力半导体器件用散热器 Heat sink for power semiconductor device  
31.080 K46 GB/T 8446.2-1987 电力半导体器件用散热器热阻和流阻测试方法 Measuring method of thermal resistance and input fluid-output fluid pressure difference of heat sink for power semiconductor device  
31.080 K46 GB/T 8446.3-1988 电力半导体器件用散热器 绝缘件和紧固件 Insulators and fasteners for heat sink for power semiconductor device  
31.240 L94 GB/T 8582-2000 电工、电子设备机械结构术语 Terminology for mechanical structures of electrotechnical and electronic equipment NEQ IEC 60916:1988
31.020 H21 GB/T 8763-1988 非蒸散型吸气材料及制品吸气性能测试方法 Test methods of gas absorption characteristic for non-evaporation gettering materials and products  
31.020 H64 GB/T 8766-1988 单水氢氧化锂 Lithium hydroxide monohydrate  
31.120 L21 GB/T 8553-1987 晶体盒总规范 Holders (Enclosures), crystal, general specification for EQV MIL-H 10056E-75
31.200 L55 GB/T 8976-1996 膜集成电路和混合膜集成电路总规范 Generic specification for film integrated circuits and hybrid film integrated circuits EQV IEC 60748-20-1988
31.100 L37 GB/T 9043-1999 通信设备过电压保护用气体放电管通用技术条件 General technical requirements of gas discharge tubes for the over-voltage protection of telecommunications installations NEQ ITU-T K.12:1995
31.060 N25 GB/T 9090-1988 标准电容器 Standard capacitors NEQ GOCT 6746-75
31.200 L55 GB/T 9178-1988 集成电路术语 Terminology for integrated circuits NEQ IEC 60748
31.120 L63 GB/T 9313-1995 数字电子计算机用阴极射线管显示设备通用技术条件 General specifications for CRT display device of computer  
31.180 L30 GB/T 9315-1988 印制电路板外形尺寸系列 Series for printed boards outside dimension  
31.060.20 L11 GB/T 9320-1988 电子设备用固定电容器 第八部分 (1): 分规范 1类高压瓷介电容器 (可供认证用) Fixed capacitors for use in electronic equipment--Part 8(1): Sectional specification: Fixed classs 1 high voltage ceramic dielectric capacitors  
31.060.20 L11 GB/T 9321-1988 电子设备用固定电容器 第八部分(1): 空白详细规范 1 类高压瓷介电容器 评定水平 E (可供认证用) Fixed capacitors for use in electronic equipment--Part 8(1): Blank detail specification: Fixed class 1 ceramic dielectric capacitors--Assessment level E  
31.060.20 L11 GB/T 9322-1988 电子设备用固定电容器 第九部分 (1): 分规范 2 类高压瓷介电容器 (可供认证用) Fixed capacitors for use in electronic equipment--Part 9(1): Sectional specification: Fixed class 2 high voltage ceramic dielectric capacitors  
31.060.20 L11 GB/T 9323-1988 电子设备用固定电容器 第九部分 (1): 空白详细规范 2类高压瓷介电容器 评定水平 E (可供认证用) Fixed capacitors for use in electronic equipment--Part 9(1): Blank detail specification: Fixed class 2 ceramic dielectric capacitors--Assessment level E  
31.060.20 L11 GB/T 9324-1996 电子设备用固定电容器 第10部分: 分规范 多层片式瓷介电容器 Fixed capacitors for use in electronic equipment--Part 10: Sectional specification--Fixed multilayer ceramic chip capacitors IDT IEC 60384-10-1989
31.060.20 L11 GB/T 9325-1996 电子设备用固定电容器 第10部分: 空白详细规范 多层片式瓷介电容器 评定水平E Fixed capacitors for use in electronic equipment--Part 10: Blank detail specification Fixed multilayer ceramic chip capacitors Assessment level E IDT IEC 60384-10-1-1989
31.030 L90 GB/T 9394-1998 电子工业用硅酸钾溶液 Potassium silicate solution for use in electronic industry  
31.200 L56 GB/T 9423-1988 半导体集成TTL电路系列和品种 54/74 ALS 系列的品种 Series and products for semiconductor TTL integrated circuits--Products of 54/74ALS family  
31.200 L56 GB/T 9424-1998 半导体器件 集成电路 第2部分: 数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 Semiconductor devices lntegrated circuits Part 2: Digital Semiconductor devices lntegrated circuits Part 2: Digital integrated circuits Section five-Blank detail specification for complementary MOS digital integrated circuits,series 4000B and 4000UB IDT IEC 60748-2-5:1992
31.200 L56 GB/T 9425-1988 半导体集成电路运算放大器空白详细规范 (可供认证用) Blank detail specification for semiconductor integrated circuit operational amplifiers EQV IEC TC 47/SC 47A(sec)161:CD or CVD
31.120 L39 GB/T 9430-1988 荧光数码显示管亮度稳定性试验方法 Methods of test of luminance stability for fluorescent display tubes  
31.100 L36 GB/T 9431-1988 阳极耗散功率大于 1kW的玻壳发射管空白详细规范 (可供认证用) Blank detail specification for glass enevelope transmitting tubes of anode dissipation over 1kW NEQ CECC 45003
31.080.30 L36 GB/T 9432-1988 工业加热用四极管空白详细规范 (可供认证用) Blank detail specification for industrial heating tetrode NEQ CECC 45002
31.100 L39 GB/T 9433-1988 过电压保护气体放电管总规范 (可供认证用) General specification of gas discharge tubes for overvoltage protection  
31.100 L39 GB/T 9434-1988 过电压保护气体放电管测试方法 Methods of measurement of gas discharge tubes for overvoltage protection  
31.120 L38 GB/T 9435-1988 彩色显像管有效屏面尺寸 Useful screen dimensions for color picture tubes EQV EIA RS324A-82
31.120 L43 GB/T 9436-1988 液晶显示器件参数符号 Letter symbols of parameter for liquid crystal display devices  
31.030 L32 GB/T 9489.1-1988 刚玉粉分析方法通则 General rule for analytical method of alundum powder  
31.030 L32 GB/T 9489.2-1988 刚玉粉中氧化钙、氧化镁、二氧化硅、三氧化二铁、二氧化钛的电感耦合高频等离子体发射光谱法测定 Determination of CaO,MgO,SiO2,Fe2O3,TiO2 in alundum powder by ICP-AES  
31.030 L32 GB/T 9489.3-1988 刚玉粉中三氧化二铁、氧化钙、氧化镁、氧化钠、氧化钾的原子吸收分光光度测定法 Determination of Fe2O3,CaO,MgO,Na2O and K2O in alundum powder by atomic absorption spectrophotometry  
31.030 L32 GB/T 9489.4-1988 刚玉粉中三氧化二铝含量的络合滴定 氟化物释放测定法 Determination of Al2O3 in alundum powder by complexometric titration  
31.030 L32 GB/T 9489.5-1988 刚玉粉中二氧化硅的比色测定法 Determination of SiO2 in alundum powder by colorimetry  
31.030 L32 GB/T 9489.6-1988 刚玉粉中二氧化钛的比色测定法 Determination of TiO2 in alundum powder by colorimetry  
31.030 L32 GB/T 9489.7-1988 刚玉粉中氯根的目视比浊测定法 Determination of chloride in alundum powder by visual turbidimetry  
31.030 L32 GB/T 9489.8-1988 刚玉粉中碳和硫的测定方法 Methods for determination of carbon and sulphur in alundum powder  
31.030 L32 GB/T 9489.9-1988 刚玉粉PH值的测定方法 Methods for determination of pH in alundum powder  
31.030 L32 GB/T 9489.10-1988 刚玉粉灼烧失重的测定方法 Method for determination of ignition loss of alundum powder  
31.030 L90 GB/T 9505-1998 蒸散型钡吸气剂 Barium flash getters  
31.030 L32 GB/T 9506.1-1988 吸气剂性能测试方法通则 Generic rules for test method of getter properties  
31.030 L32 GB/T 9506.2-1988 蒸散型钡吸气剂得钡量测试方法 Test method for barium yield of barium flash getter  
31.030 L32 GB/T 9506.3-1988 蒸散型钡吸气剂载料和模中钡量的测定 Test method for barium content in getter fill and getter film of barium flash getter  
31.030 L32 GB/T 9506.4-1988 吸气剂放气量测试方法 Test method for amount of gas evolved from getter  
31.030 L32 GB/T 9506.5-1988 掺氮吸气剂释氮吸气动态曲线测试方法 Test method for nitrogen-released and gas-absorbed dynamic curve of nitrogen-doped getter  
31.030 L32 GB/T 9506.6-1988 掺氮吸气剂钡膜分布测试方法 Test method for barium film distribution of nitrogen-doped getter  
31.030 L32 GB/T 9506.7-1988 蒸散型钡吸气剂吸气性能测试方法 Test method for gettering properties of barium flash getter  
31.030 L32 GB/T 9506.8-1988 非蒸散型吸气剂吸气性能测试方法 Test method for gettering properties of non-evaporable getter  
31.030 L32 GB/T 9506.9-1988 吸气剂装载量测试方法 Test method for amount of filling getter  
31.030 L32 GB/T 9506.10-1988 吸气剂压制或烧结牢固度测试方法 Test method for firmness of getter by pressure or sinter  
31.030 L32 GB/T 9506.11-1988 吸气剂支架焊接强度测试方法 Test method for weld strenght of getter support  
31.020 L28 GB/T 9530-1988 电子陶瓷名词术语 Terms for electronic ceramics  
31.020 L28 GB/T 9531.1-1988 电子陶瓷零件技术条件 General specification for electronic ceramic parts  
31.020 L28 GB/T 9531.2-1988 A 类瓷件技术条件 Specification for ceramic parts,type A  
31.020 L28 GB/T 9531.3-1988 B 类瓷件技术条件 Specification for ceramic parts,type B  
31.020 L28 GB/T 9531.4-1988 C 类瓷件技术条件 Specification for ceramic parts,type C  
31.020 L28 GB/T 9531.5-1988 D 类瓷件技术条件 Specification for ceramic parts,type D  
31.020 L28 GB/T 9531.6-1988 E 类瓷件技术条件 Specification for ceramic part,type E  
31.020 L28 GB/T 9531.7-1988 F 类瓷件技术条件 Specification for ceramic parts,type F  
31.020 L21 GB/T 9532-1988 铌酸锂、钽酸锂、锗酸铋、硅酸铋压电单晶材料型号命名方法 Designations for LiNbO3, LiTaO3, Bi12, GeO20, Bi12 SiO20 piezoelectric crystals  
31.220.20 L22 GB/T 9536-1995 电子设备用机电开关 第1部分: 总规范 Electromechanical switches for use in electronic equipment--Part 1: Generic specification IDT IEC 61020-1:1991
31.220.20 L22 GB/T 9537-1988 电子设备用键盘开关 第一部分: 总规范 (可供认证用) Keyboard switches for use in electronic equipment--Part 1: Generic specification  
31.040.10 L13 GB/T 9546-1995 电子设备用固定电阻器 第8部分:分规范:片式固定电阻器 Fixed resistors for use in electronic equipment--Part 8: Sectional specification: Fixed chip resistors IDT IEC 60115-8-1989
31.120 L39 GB/T 9586-1988 荧光数码显示管加速寿命试验方法 Methods of accelerated life test of fluorescent display tubes  
31.100 L36 GB/T 9587-1988 阳极耗散功率大于1kW的金属陶瓷发射管空白详细规范(可供认证用) Blank detail specification for matal ceramic transmitting tubes of anode dissipation over 1kW NEQ CECC 45003-75
31.100 L39 GB/T 9588-1988 盖革-弥勒计数管测试方法 Methods of measurement of Geiger-muller counter tubes  
31.060.20 L11 GB/T 9597-1988 电子设备用固定电容器 分规范: 1类高功率瓷介电容器(可供认证用) Fixed capacitors for use in electronic equipment--Sectional specification--Fixed high reactive power--Classl 1 ceramic dielectric capacitors NEQ IEC 60384-8-82
31.060.20 L11 GB/T 9598-1988 电子设备用固定电容器 空白详细规范: 1 类高功率瓷介电容器 评定水平E(可供认证用) Fixed capacitors for use in electronic equipment--Blank detail specification--Fixed high reactive power--Classl 1 ceramic dielectric capacitors assessment level E NEQ IEC 60384-8-1-82
31.100 L37 GB/T 9602-1988 连续波磁控管电性能测试方法 Measuring methods of electrical properties of continuous wave magnetrons  
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.060.30 L11 GB/T 10185-1988 电子设备用固定电容器第7部分:分规范: 金属箔式聚苯乙烯膜介质直流固定电容器 Fixed capacitors for use in electronic equipment--Part 7: Sectional specification: Fixed polystyrene film dielectric metal foil d.c. capacitors IDT IEC 60389-74
31.060.30 L11 GB/T 10186-1988 电子设备用固定电容器 第7部分: 空白详细规范:金属箔式聚苯乙烯膜介质直流固定电容器 评定水平E (可供认证用) Fixed capacitors for use in electronic equipment--Part 7: Blank detail specification: Fixed polystyrene film dielectric metal foil d.c. capacitors--Assessment level E IDT IEC 60384-7
31.060.30 L11 GB/T 10188-1988 电子设备用固定电容器 第13部分: 分规范: 金属箔式聚丙烯膜介质直流固定电容器 (可供认证用) Fixed capacitors for use in electronic equipment--Part 13: Sectional specification: Fixed polypropylene film dielectric metal foil d.c. capacitors IDT IEC 60384-13-85
31.060.30 L11 GB/T 10189-1988 电子设备用固定电容器 第13部分: 空白详细规范: 金属箔式聚丙烯膜介质直流固定电容器 评定水平E (可供认证用) Fixed capacitors for use in electronic equipment--Part 13: Blank detail specification: Fixed polypropylene film dielectric metal foil d.c. capacitors--Assessment level E IDT IEC 60384-13-1-85
31.060.30 L11 GB/T 10190-1988 电子设备用固定电容器 第16部分: 分规范: 金属化聚丙烯膜介质直流固定电容器 (可供认证用) Fixed capacitors for use in electronic equipment--Part 16: Sectional specification: Fixed metallized polypropylene film dielectric d.c. capacitors IDT IEC 60384-16-82
31.060.30 L11 GB/T 10191-1988 电子设备用固定电容器 第16部分: 空白详细规范: 金属化聚丙烯膜介质直流固定电容器 评定水平E (可供认证用) Fixed capacitors for use in electronic equipment--Part 16: Blank detail specification: Fixed metallized polypropylene film dielectric d.c. capacitors--Assessment level E IDT IEC 60384-16-1-82
31.040.30 L15 GB/T 10193-1997 电子设备用压敏电阻器 第1部分: 总规范 Varistors for use in electronic equipment--Part 1: Generic specification IDT IEC 61051-1:1991
31.040.30 L15 GB/T 10194-1997 电子设备用压敏电阻器 第2部分: 分规范 浪涌抑制型压敏电阻器 Varistors for use in electronic equipment-Part 2: Sectional specification for surge suppression varistors IDT IEC 61051-2:1991
31.040.30 L15 GB/T 10195.1-1997 电子设备用压敏电阻器 第2部分: 空白详细规范 碳化硅浪涌抑制型压敏电阻器 评定水平E Varistors for use in electronic equipment-Part 2: Blank detail specification for silicon carbide surge suppression varistors Assessment leval E IDT IEC 61051-2-1:1991
31.040.30 L15 GB/T 10195.2-1997 电子设备用压敏电阻器 第2部分: 空白详细规范 氧化锌浪涌抑制型压敏电阻器 评定水平E Varistors for use in electronic equipment-Part 2: Blank detail specification for zinc oxide surge suppression varistors Assessment level E IDT IEC 61051-2-2:1991
31.030 L32 GB/T 10304.1-1988 阴极碳酸盐分析方法通则 General rule for analytical method of cathode carbonate  
31.030 L32 GB/T 10304.2-1988 阴极碳酸盐中碳酸钡含量的测定 重铬酸钾碘量滴定法 Determination of BaCo3 in cathode carbonate by dichromate iodimetry  
31.030 L32 GB/T 10304.3-1988 阴极碳酸盐中碳酸钙含量的络合滴定测定 Determination of CaCo3 in cathod carbonate by complexometric titration  
31.030 L32 GB/T 10304.4-1988 阴极碳酸盐中碳酸钙、碳酸锶的原子吸收分光光度测定 Determination of CaCo3, SrCo3 in cathode carbonate by atomic absorption spectrophotometry  
31.030 L32 GB/T 10304.5-1988 阴极碳酸盐中硝酸根的测定 Determination of nitrate in cathode carbonate  
31.030 L32 GB/T 10304.6-1988 阴极碳酸盐中钠的原子吸收分光光度测定 Determination of Na in cathode carbonate by atomic absorption spectrophotometry  
31.030 L32 GB/T 10304.7-1988 阴极碳酸盐中盐酸不溶物的测定 Determination of nonsolute for chloric acid in cathode carbonate  
31.030 L32 GB/T 10304.8-1988 阴极碳酸盐中铁的测定 Determination of Fe in cathode carbonate  
31.030 L32 GB/T 10304.9-1988 阴极碳硫盐中氯根的测定 Determination of chloride in cathode carbonate  
31.030 L32 GB/T 10304.10-1988 阴极碳酸盐中硫酸根的测定 Determination of sulphate in cathode carbonate  
31.030 L32 GB/T 10304.11-1988 阴极碳酸盐中重金属(以Pb计)的测定 Determination of heavy metals in cathode carbonate  
31.030 L32 GB/T 10304.12-1988 阴极碳酸盐灼烧失重的测定 Determination of ignition losses in cathode carbonate  
31.030 L32 GB/T 10305-1988 阴极碳酸盐粒度分布的测定 离心沉降法 Test method for particle distribution of cathode carb-onates by centrifugation sedimentation  
31.030 L32 GB/T 10306-1988 阴极碳酸盐 Cathode carbonates  
31.030 L32 GB/T 10307-1988 阴极碳酸盐牌号命名方法 Designation for cathode carbonates NEQ ASTM F70
31.030 L32 GB/T 10308-1988 示波管和显示管用Y1荧光粉 Phosphor Y1 for oscilloscope tubes and display tubes  
31.030 L32 GB/T 10309-1988 示波管和显示管用Y14荧光粉 Phosphor Y14 for oscilloscope tubes and display tubes  
31.030 L32 GB/T 10310-1988 K白显像管用Y4-W2荧光粉 Phosphor Y4-W2 for black-white picture tubes  
31.030 L32 GB/T 10311-1988 K白显像管用Y4-B1荧光粉 Phosphor Y4-B1 for black-white picture tubes  
31.030 L32 GB/T 10312-1988 K白显像管用Y4-Y2荧光粉 Phosphor Y4-Y2 for black-white picture tubes  
31.030 L32 GB/T 10313-1988 雷达指示管用Y16荧光粉 Phosphor Y16 for radar indicator tubes  
31.030 L32 GB/T 10314-1988 双层屏指示管用Y3荧光粉 Phosphor Y3 for double-decker screen indicator tubes  
31.030 L32 GB/T 10315-1988 双层屏指示管用G11荧光粉 Phosphor G11 for double-decker screen indicator tubes  
31.030 L32 GB/T 10316-1988 双层屏指示管用G16荧光粉 Phosphor G16 for double-decker screen indicator tubes  
31.030 L32 GB/T 10317-1988 示波管和显示管用Y10荧光粉 Phosphor Y10 for oscilloscope tubes and image display tubes  
31.030 L32 GB/T 10318-1988 夜视器件和存储管用Y20荧光粉 Phosphor Y20 for low-light-level picture tubes and storage tubes  
31.260 L51 GB 10320-1995 激光设备和设施的电气安全 Electrical safety of laser equipment and installations EQV IEC 60820-1986
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.060.70 K42 GB/T 11024.1-2001 标称电压1kV以上交流电力系统用并联电容器 第1部分: 总则--性能、试验和定额--安全要求--安装和运行导则 Shunt capacitors for a.c.power systems having a rated voltage above 1kV Part 1: General--Performance,testing and rating--Safety requirements--Guide for installation and operation EQV IEC 60871-1:1997
31.060.70 K42 GB/T 11024.2-2001 标称电压1kV以上交流电力系统用并联电容器 第2部分: 耐久性试验 Shunt capacitors for a.c.power systems having a rated voltage above 1kV Part 2: Endurance testing IDT IEC TS 60871-2:1999
31.060.70 K42 GB/T 11024.3-2001 标称电压1kV以上交流电力系统用并联电容器 第3部分: 并联电容器和并联电容器组的保护 Shunt capacitors for a.c.power systems having a rated voltage above 1kV Part 3: Protection of shunt capacitors and shunt capacitor banks EQV IEC TR 60871-3:1996
31.060.70 K42 GB/T 11024.4-2001 标称电压1kV以上交流电力系统用并联电容器 第4部分: 内部熔丝 Shunt capacitors for a.c.power systems having rated voltage above 1kV Part 4: Internal fuses IDT IEC 60871-4:1996
31.020;
31.
L32 GB/T 11113-1989 人造石英晶体中杂质的分析方法 Analytical method for impurities in the synthetic quartz crystal  
31.020;
31-
L32 GB/T 11114-1989 人造石英晶体位错的X 射线形貌检测方法 Method for detecting dislocations of synthetic quartz crystal using X-ray topographic technique  
31.060 N25 GB/T 11149-1989 标准电容箱 Standard capacitance boxes NEQ ΓOCT 6746-75
31.260 L48 GB/T 11153-1989 激光小功率计性能检测方法 Parameters testing method of laser power meter in low range  
31.260 L32 GB/T 11293-1989 固体激光材料名词术语 Terms and definitions of solid-state laser materials  
31.260 L32 GB/T 11295-1989 激光晶体棒型号命名方法 Designation for laser crystal rods  
31.020 L32 GB/T 11296-1989 红外探测材料型号命名方法 Designation for infrared detecting materials  
31.020 L32 GB/T 11297.1-1989 激光棒波前畸变的测量方法 Test method for wavefront distortion of laser rods  
31.260 L32 GB/T 11297.2-1989 激光棒侧向散射系数的测量方法 Test method for side direction scattering coefficient of laser rods  
31.260 L32 GB/T 11297.3-1989 掺钕钇铝石榴石激光棒消光比的测量方法 Test method for extinction ratio of Nd: YAG laser rods  
31.260 L32 GB/T 11297.4-1989 掺钕钇铝石榴石激光棒长脉冲激光阈值及斜率效率的测量方法 Test method for normal pulse lasing threshold and slope efficiency of Nd: YAG laser rods  
31.260 L32 GB/T 11297.5-1989 掺钕钇铝石榴石激光棒连续激光阈值、斜率效率和输出功率的测量方法 Test method for continous lasing threshold, slope efficiency and output power of Nb: YAG laser rods  
31.030 L32 GB/T 11297.8-1989 热释电材料热释电系数的测试方法 Test method for pyroelectric coefficient of pyroelectric materials  
31.030 L32 GB/T 11297.9-1989 热释电材料介质损耗角正切 tanδ的测试方法 Test method for dielectric tangent of loss angle of pyroelectric material  
31.020 L32 GB/T 11297.10-1989 热释电材料居里温度 Tc 的测试方法 Test method for curie temperature of pyroelectric materials  
31.020 L32 GB/T 11297.11-1989 热释电材料介电常数的测试方法 Test method for the dielectric constant of pyroelectric materials  
31.020 L32 GB/T 11297.12-1989 电光晶体铌酸锂、磷酸二氢钾和磷酸二氘钾消光比的测量方法 Test method for extinction ratio of LN, KDP and KDP electrooptic crystal  
31.060.60 L11 GB/T 11300-1989 电子设备用A 类调谐可变电容器空白详细规范 Blank detail specification for variable tuning capacitors type A in electronic equipments EQV IEC 60418-2A-80
31.060.60 L11 GB/T 11301-1989 电子设备用装有整体C 类预调电容器的A 类调谐可变电容器空白详细规范 Blank detail specification for variable tuning capacitors type A fitted with integral preset capacitors type C in electronic equipments EQV IEC 60418-2B-80
31.060.60 L11 GB/T 11302-1989 电子设备用B 类微调可变电容器空白详细规范 Blank detail specification for variable trimmer capacitors type B in electronic equipments EQV IEC 60418-3A-80
31.060.60 L11 GB/T 11303-1989 电子设备用C 类预调可变电容器 空白详细规范 Blank detail specification for variable preset capacitors type C in electronic equipments EQV IBC 60418-4A
31.060.30 L11 GB/T 11305-1989 电子设备用固定电容器 分规范: 3 类瓷介电容器 (可供认证用) Fixed capacitors for use in electronic equipment - Sectional specification: Fixed capacitors of ceramic dielectric, class 3  
31.060.30 L11 GB/T 11306-1989 电子设备用固定电容器 空白详细规范: 3 类瓷介电容器 评定水平 E (可供认证用) Fixed capacitors for use in electronic equipment - Blank detail specification: Fixed capacitors of ceramic dielectric, class 3 - Assessment level E NEQ IEC 60384-9-1-84
31.140 L32 GB/T 11309-1989 压电陶瓷材料性能测试方法 纵向压电应变常数 d33的准静态测试 Test methods for the properties of piezoelectric ceramics - Quasi-static test for piezoelectric strain content d33  
31.140 L32 GB/T 11310-1989 压电陶瓷材料性能测试方法 相对自由介电常数温度特性的测试 Test methods for the properties of piezoelectric ceramics - Test methods for temperature characteristics of relative free dielectric constants  
31.140 L32 GB/T 11311-1989 压电陶瓷材料性能测试方法 泊松比бE的测试 Test methods for the properties of piezoelectric ceramics test for Poisson's ratio  
31.140 L32 GB/T 11312-1989 压电陶瓷材料和压电晶体声表面波性能测试方法 Test methods for SAW properties of piezoelectric ceramics and crystals  
31.220.10 L23 GB/T 11313-1996 射频连接器 第1部分: 总规范 一般要求和试验方法 Redio-frequency connectors--Part 1: Generic specification--General requirements and measuring methods IDT IEC 61169-1-1992
31.140 L32 GB/T 11320-1989 压电陶瓷材料性能测试方法 低机械品质因数压电陶瓷材料性能的测试 Test methods for the properties of piezoelectric ceramics material with the low mechanical quality factor  
31.140 L18 GB/T 11387-1989 压电陶瓷材料静态弯曲强度试验方法 Testing method for static flexural strength of piezoellectric ceramics NEQ ISO 12370-80
31.030 L90 GB/T 11446.1-1997 电子级水 Electronic grade water NEQ ASTM D5127:1990
31.030 L90 GB/T 11446.3-1997 电子级水测试方法通则 Generic rules for test methods of electronic grade water NEQ ASTM D5196:1991
31.030 L90 GB/T 11446.4-1997 电子级水电阻率的测试方法 Test methods for resistivity of electronic grade water NEQ ASTM D5127:1990
31.030 L90 GB/T 11446.5-1997 电子级水中痕量金属的原子吸收分光光度测试方法 Test method for measuring trace metals in electronic grade water by atomic absorption spectrophotometry NEQ ASTM D5127:1990
31.030 L90 GB/T 11446.6-1997 电子级水中二氧化硅的分光光度测试方法 Test method for Si2O in electronic grade water by spectrophotometer NEQ ASTM D5127:1990
31.030 L90 GB/T 11446.7-1997 电子级水中痕量氯离子、硝酸根离子、磷酸根离子、硫酸根离子的离子色谱测试方法 Test method for trace chloride,nitrate,phosphate,sulfate in electronic grade water by ion-chromatography NEQ ASTM D5127:1990
31.030 L90 GB/T 11446.8-1997 电子级水中总有机碳的测试方法 Test method for total organic carbon in electronic grade water NEQ ASTM D5127-90
31.030 L90 GB/T 11446.9-1997 电子级水中微粒的仪器测试方法 Test method for particles in electronic grade water by instrument NEQ ASTM D5127:1990
31.030 L90 GB/T 11446.10-1997 电子级水中细菌总数的滤膜培养测试方法 Test method for total bacterial count in electronic grade water by membrane filters NEQ ASTM D5127:1990
31.120 L38 GB/T 11478-1989 摄象管总规范(可供认证用) Generic specification for camera tubes EQV CECC 13000-81
31.120 L38 GB/T 11479-1989 摄象管空白详细规范(可供认证用) Blank detail specification for camera tubes EQV CECC 13000-81
31.120 L38 GB/T 11480-1989 摄象管测试方法 Methods of measurement for camera tubes NEQ IEC 60151-26-71
31.120 L39 GB/T 11482-1989 交流等离子体显示器件总规范 (可供认证用) Generic specification for AC plasma display devicas  
31.120 L39 GB/T 11483-1989 交流等离子体显示器件测试方法 Methods of measurement for Ac plasma display devices  
31.100 L38 GB/T 11490-1989 彩色显象管管基尺寸 Dimensions of base for colour picture tube  
31.030 L32 GB/T 11496.1-1989 彩色显示管用Y30-G1 荧光粉 Phosphors Y30-G1 for color display tubes  
31.030 L32 GB/T 11496.2-1989 彩色显示管用Y30-B1荧光粉 Phosphor Y30-B1 for color display tubes  
31.200 L56 GB/T 11497.1-1989 半导体集成电路CMOS电路系列和品种 54/74HC 系列的品种 Series and products for CMOS semiconductor integrated circuits products of series 54/74HC  
31.200 L56 GB/T 11497.2-1989 半导体集成电路CMOS电路系列和品种 54/74HCT 系列的品种 Series and products for CMOS semiconductor integrated circuits products of series 54/74HCT  
31.200 L55 GB/T 11498-1989 膜集成电路和混合膜集成电路分规范 (采用鉴定批准程序) (可供认证用) Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure  
31.080.01 L40 GB/T 11499-2001 半导体分立器件文字符号 Letter symbols for discrete semiconductor devices  
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.100 L39 GB/T 12078-1989 X 射线管总规范 (可供认证用) Generic specification for X-ray tubes  
31.100 L39 GB/T 12079-1989 X 射线管光电性能测试方法 Measurements of the photoelectric properties for X-ray tubes  
31.260 L39 GB/T 12082-1989 气体激光器文字符号 Letter symbols for gas lasers  
31.260 L39 GB/T 12083-1989 气体激光器电源系列 Power supply series for gas lasers IDT ГOCT 1904-79
31.200 L56 GB/T 12084-1989 半导体集成电路TTL 电路系列和品种 54/74F系列的品种 Series and products for TTL semiconductor integrated circuits - products of series 54/74F  
31.220.10 L23 GB/T 12272-1990 射频同轴连接器耐射频高电位电压测试方法 Measuring method of radio-frequency high potential withstanding voltage for radio-frequency coaxial connectors  
31.020 L21 GB/T 12273-1996 石英晶体元件 电子元器件质量评定体系规范 第1部分: 总规范 Quartz crystal units--A specification in the quality assessment system for electronic components--Part 1: Generic specification IDT IEC 61178-1-1993
31.140 L21 GB/T 12274-1990 石英晶体振荡器总规范 (可供认证用) Quartz crystal controlled oscillators - Generic specification for IDT IEC 60679-1
31.140 L21 GB/T 12275-1990 石英晶体振荡器型号命名方法 The rule of type designation for quartz crystal oscillators  
31.040.10 L13 GB/T 12276-1990 电子设备用固定电阻器 第七部分: 分规范 各电阻器不可单独测量的固定电阻网络 (可供认证用) Fixed resistors for use in electronic equipment Part 7: Sectional specification:Fixed resistor networks in which not all resistors are individually measurable IDT IEC 60115-7-84
31.040.10 L13 GB/T 12277-1990 电子设备用固定电阻器 第七部分: 空白详细规范: 各电阻器不可单独测量的固定电阻网络 评定水平 E (可供认证用) Fixed resistors for use in electronic equipment - Part 7 : Blank detail specification - Fixed resistor networks in which not all resistors are individually measurable?Assessment level E EQV IEC 60115-7-1-84
31.080.30 L40 GB/T 12300-1990 功率晶体管安全工作区测试方法 Test methods of safe operating area for power transistors NEQ MIL STD 750B
31.260 L51 GB/T 12507.2-1997 光纤光缆连接器 第2部分: F-SMA型光纤光缆连接器分规范 Connectors for optical fibres and cables-Part 2: Sectional specification for fibre optic connector--Type F-SMA IDT IEC 60874-2:1993
31.220.20 L51 GB/T 12511-1990 纤维光学开关 第一部分: 总规范(可供认证用) ibre optic switches - Part 1: Generic specification IDT IEC 60876-1-86
31.220.20 L51 GB/T 12512-1990 纤维光学衰减器 第一部分: 总规范(可供认证用) Fibre optic attenuators - Part 1: Generic specification IDT IEC 60869-1-88
31.180 L39 GB/T 12559-1990 印制电路用照相底图图形系列 The patternes series for artwork master of printed circuits  
31.080.01 L40 GB/T 12560-1999 半导体器件 分立器件分规范 Semiconductor devices--Sectional specification for discrete devices IDT IEC 60747-11:1985
31.080.10 L45 GB/T 12561-1990 发光二极管空白详细规范 (可供认证用) Blank detail specification for light emitting diodes  
31.080.10 L41 GB/T 12562-1990 PIN 二极管空白详细规范 (可供认证用) Blank detail specification for PIN diodes  
31.100 L39 GB/T 12564-1990 光电倍搖ヌ总规范 (可供认证用) Generic specification for photomultiplier tubes  
31.260 L50 GB/T 12565-1990 半导体器件 光电子器件分规范 (可供认证用) Semiconductor devices - Sectional specification for optoelectronic devices  
31.120 L38 GB/T 12567-1990 直观存储管测试方法 Methods of measurement of display storage tubes  
31.120 L38 GB/T 12568-1990 直观存储管分规范 (可供认证用) Sectional specification for display storage tubes IDT CECC 11100-84
31.120 L38 GB/T 12569-1990 直观存储管空白详细规范 (可供认证用) Blank detail specification for display storage tubes IDT CECC 11101-84
31.120 L38 GB/T 12570-1990 单色显示管空白详细规范 (可供认证用) Blank detail specification for monochrome display tubes NEQ CECC 11001-86
31.120 L38 GB/T 12571-1990 单色显示管测试方法 Methods of measurement of monochrome display tubes NEQ CECC 11000-86
31.180 L30 GB/T 12629-1990 限定燃烧性的薄覆铜箔环氧玻璃布层压板 (制造多层印制板用) Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards EQV IEC 60249-2-12-87
31.180 L30 GB/T 12630-1990 一般用途的薄覆铜箔环氧玻璃布层压板 (制造多层印制板用) Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, For use in the fabrication of multilayer printed boards IDT IEC 60249-2-11-87
31.180 L30 GB/T 12631-1990 印制导线电阻测试方法 Test method for resistance of conductor of printed boards NEQ IEC 60326-2-76
31.140 L32 GB/T 12633-1990 压电晶体性能测试术语 Terms for the measurements of the properties of the piezoelectric crystals  
31.140 L32 GB/T 12634-1990 压电晶体电弹常数测试方法 Test methods for electroelastic constants of piezoelectric crystals  
31.060 K48 GB/T 12747-1991 自愈式低电压并联电容器 Low voltage shunt capacitors of the self-healing type EQV IEC 60831-1-88
31.200 L55 GB/T 12750-1991 半导体集成电路分规范 (不包括混合电路) (可供认证用) Sectional specification for semiconductor integrated circuits, excluding hybrid circuits  
31.060.60 L11 GB/T 12775-1991 电子设备用圆片型瓷介预调可变电容器总规范 Generic specification for disc-style ceramic dielectric variable pre-set capacitors in electronic equipment NEQ IEC 60499-1
31.060.40 L11 GB/T 12794-1991 电子设备用固定电容器 第十五部分: 空白详细规范 非固体电解质箔电极钽电容器 评定水平 E (可供认证用) Fixed capacitors for use in electronic equipment - Part 15: Blank detail specification - Tantalum capacitors with non-solid electrolyte and foil electrode - Assessment level E IDT IEC 60384-15-1-84
31.060.40 L11 GB/T 12795-1991 电子设备用固定电容器 第十五部分: 空白详细规范 非固体电解质多孔阳极钽电容器 评定水平 E (可供认证用) Fixed capacitors for use in electronic equipment - Part 15: Blank detail specification - Tantalum capacitors with non-solid electrolyte and porous anode - Assessment level E IDT IEC 60385-15-2-84
31.200 L55 GB/T 12842-1991 膜集成电路和混合膜集成电路术语 Terminology for film integrated circuits and hybrid film integrated circuits  
31.200 L55 GB/T 12843-1991 半导体集成电路 微处理器及外围接口电路电参数测试方法的基本原理 General principle of measuring methods of microproces sors and peripheral interface circuits' parameters for semiconductor integrated circuits  
31.200 L56 GB/T 12844-1991 半导体集成电路非线性电路系列和品种 采样/ 保持放大器的品种 Series and products of nonlinear circuits for semiconductor integrated circuits?Products of sample/hold amplifiers  
31.200 L56 GB/T 12845-1991 半导体集成电路非线性电路系列和品种 电压/ 频率和频率/ 电压转换器的品种 Series and products of nonlinear circuits for semiconductor integrated circuits - Products of voltage/frequency and frequency/voltage converters  
31.080.20 L39 GB/T 12846-1991 脉冲闸流管总规范 (可供认证用) General specification for pulse thyratrons NEQ BS 9014-79
31.080.20 L39 GB/T 12847-1991 氢闸流管空白详细规范 (可供认证用) Blank detail specification for hydrogen thyratrons  
31.120 L49 GB/T 12848-1991 扭曲向列型液晶显示器件总规范 (可供认证用) Generic specification of twisted nematic liquid crystal display devices  
31.120 L49 GB/T 12849-1991 钟、表用扭曲向列型液晶显示器件空白详细规范 (可供认证用) Blank detail specification of twisted nematic liquid crystal displays for watches  
31.120 L49 GB/T 12850-1991 计算器用扭曲向列型液晶显示器件空白详细规范 (可供认证用) Blank detail specification of twisted nematic liquid crystal displays for calculators  
31.120 L49 GB/T 12851-1991 仪器、仪表用扭曲向列型液晶显示器件空白详细规范 (可供认证用) Blank detail specification of twisted nematic liquid crystal displays for instruments  
31.100 L37 GB/T 12852-2001 磁控管总规范 General specification for magnetrons NEQ BS EN 136000:1993
31.100 L37 GB/T 12853-2001 连续波磁控管空白详细规范 Blank detail specification for continuous wave magnetrons NEQ BS EN 136002:1996
31.100 L36 GB/T 12854-1991 脉冲调制管空白详细规范 (可供认证用) Blank detail specification for pulse modulator tubes  
31.100 L35 GB/T 12855-1991 小功率发射管的使用和维护 Application and care for small power transmitting tubes  
31.140 L21 GB/T 12859-1991 电子设备用压电陶瓷谐振器总规范 (可供认证用) Generic specification for piezoelectric ceramic resonators for use in electronic equipment  
31.140 L21 GB/T 12860-1991 电子设备用压电陶瓷谐振器分规范 低频压电陶瓷谐振器 Piezoelectric ceramic resonators for use in electronic equipment - Sectional specification for piezoelectric ceramic resonators for low frequency  
31.140 L21 GB/T 12861-1991 电子设备用压电陶瓷谐振器空白详细规范 低频压电陶瓷谐振器 评定水平 E(可供认证用) Piezoelectric ceramic resonators for use in electronic equipment - Blank detail specification for piezoelectric ceramic resonators for low frequency - Assessment level E  
31.140 L21 GB/T 12862-1991 电子设备用压电陶瓷谐振器分规范 高频压电陶瓷谐振器 (可供认证用) Piezoelectric ceramic resonators for use in electronic equipment - Sectional specification for piezoelectric ceramic resonators for high frequency  
31.160 L21 GB/T 12863-1991 电子设备用压电陶瓷谐振器空白详细规范 高频压电陶瓷谐振器 评定水平 E(可供认证用) Piezoelectric ceramic resonators for use in electronic equipment - Blank detail specification for piezoelectric ceramic resonators for high frequency - Assessment level E  
31.160 L18 GB/T 12864-1997 电子设备用压电陶瓷滤波器 电子元器件质量评定体系规范 第2部分: 分规范 鉴定批准 Piezoelectric ceramic filters for use in electronic equipment A specification in the quality assessment system for electronic components-Part 2: Sectional specification--Qualification approval IDT IEC 61261-2:1994
31.160 L18 GB/T 12865-1997 电子设备用压电陶瓷滤波器 电子元器件质量评定体系规范 第2部分; 分规范 鉴定批准 第一篇: 空白详细规范 评定水平E Piezoelectric ceramic filters for use in electronic equipment A specification in the quality assessment system for electronic components-Part 2: Sectional specification--Qualification approval Section 1: Blank detail specification-Assessment level E IDT IEC 61261-2-1:1994
31.220 L05 GB/T 12992-1991 电子设备强迫风冷热特性测试方法 Measuring methods of thermal characteristic for forced air cooling of electronic equipment  
31.220 L05 GB/T 12993-1991 电子设备热性能评定 Thermal performances evaluation for electronic equipment  
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.200 L55 GB/T 13062-1991 膜集成电路和混合膜集成电路空白详细规范 (可供认证用) Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure  
31.080.10 L41 GB/T 13063-1991 电流调整和电流基准二极管空白详细规范 Blank detail specification for current-regulator and current-reference diodes  
31.200 L56 GB/T 13064-1991 半导体集成电路系列和品种 复印机用系列的品种 Series and products for semiconductor integrated circuits - Products for use in copying machine  
31.100 L39 GB/T 13065-1991 过电压保护气体放电管空白详细规范 (可供认证用) Blank detail specification of gas discharge tubes for overvoltage protection  
31.080.20 L41 GB/T 13066-1991 单结晶体管空白详细规范 Blank detail specification for unijunction transistors  
31.200 L56 GB/T 13067-1991 半导体集成电路系列和品种 石英电子钟表用系列的品种 Series and products for semiconductor integrated circuits - Products for use in quartz electronic clock and watch  
31.200 L56 GB/T 13068-1991 半导体集成电路系列和品种 磁敏传感器用系列的品种 Series and products for semiconductor integrated circuits - Products for use in transducer sensitive to magnetic  
31.200 L56 GB/T 13069-1991 半导体集成电路系列和品种 数控机床用系列的品种 Series and products for semiconductor integrated circuits - Products for use in numerical control machine tool  
31.080.20 K46 GB/T 13150-1991 100A以上环境或管壳额定双向三极晶闸管空白详细规范 Blank detail specification for bidirectional triode thyristors, ambient or case-rated, above 100A  
31.080.20 K46 GB/T 13151-1991 100A以上环境或管壳额定反向阻断三极晶闸管空白详细规范 Blank detail specification for reverse blocking triode thyristors, ambient or case-rated, above 100A  
31.080.20 K46 GB/T 13152-1991 5A/5A 以上环境或管壳额定逆导三极晶闸管空白详细规范 Blank detail specification for reverse conducting triode thyristors, ambient or case-rated, 5A/5A and above  
31.080.20 K46 GB/T 13153-1991 5A以上环境或管壳额定可关断晶闸管空白详细规范 Blank detail specification for gate turn-off thyristors, ambient or case-rated, 5A and above  
31.040.30 L15 GB/T 13189-1991 旁热式负温度系数热敏电阻器总规范 (可供认证用) Geanral specification for the indirectly heated thermistors with negative temperature coefficient  
31.260 L51 GB/T 13265.1-1997 纤维光学隔离器 第1部分: 总规范 Fiber optic isolators--Part 1: Generic specification IDT IEC 61202-1-1994
31.260 L51 GB/T 13265.2-1997 纤维光学隔离器 第1-1部分: 空白详细规范 Fibre optic isolators--Part 1-1: Blank detail specification IDT IEC 61202-1-1:1994
31.020 L26 GB/T 13415-1992 射频混频器总规范 Mixers, radio frequency, general specification for NEQ MIL M28839
31.220.20 L26 GB/T 13416-1992 射频传输线(同轴)开关总规范 Switches(coaxial), RF transmission line, general specification for NEQ MIL S3928c(1)
31.220.20 L22 GB/T 13419-1998 电子设备用机电开关 第6部分: 微动开关分规范 Electromechanical switches for use in electronic equipment Part 6: Sectional specification for sensitive switches IDT IEC 61020-6:1991
31.220.20 L22 GB/T 13420-1998 电子设备用机电开关 第6部分:微动开关分规范 第1篇:空白详细规范 Electromechanical switches for use in electronic equipment Part 6: Sectional specification for sensitive switches Section 1: Blank 1: Blank detail specification IDT IEC 61020-6-1:1991
31.180 L30 GB/T 13555-1992 印制电路用挠性覆铜箔聚酰亚胺薄膜 Flexible copper-clad polyimide film for printed circuits EQV IEC 60249-2-13-87
31.180 L30 GB/T 13556-1992 印制电路用挠性覆铜箔聚脂薄膜 Flexible copper-clad polyester film for printed circuits EQV IEC 60294-2-8-87
31.180 L30 GB/T 13557-1992 印制电路用挠性覆铜箔材料试验方法 Test methods for flexible copper-clad material for printed circuits EQV IEC 60249-1-82
31.020 L52 GB/T 13583-1992 红外探测器外形尺寸系列 Outline dimension series of infrared detectors  
31.020 L52 GB/T 13584-1992 红外探测器参数测试方法 Measuring methods for parameters of infrared detectors  
31.260 L39 GB/T 13706-1992 光电管总规范 (可供认证用) Generic specification for phototubes  
31.260 L39 GB/T 13707-1992 光电管空白详细规范 (可供认证用) Blank detail specification for phototubes  
31.260 L39 GB/T 13708-1992 光电倍搖ヌ空白详细规范 (可供认证用) Blank detail specification for photomultiplier tubes  
31.100 L39 GB/T 13709-1992 检测用X射线管空白详细规范 (可供认证用) Blank detail specification of X-ray tubes for detection  
31.100 L39 GB/T 13710-1992 分析用X射线管空白详细规范 (可供认证用) Blank detail for specification of X-ray tubes for analysis  
31.260 L51 GB/T 13739-1992 激光辐射横模鉴别方法 Testing method of transverse mode of laser radiation  
31.260 L51 GB/T 13740-1992 激光辐射发散角测试方法 Testing method of divergence angle of laser radiation  
31.260 L51 GB/T 13741-1992 激光辐射光束直径测试方法 Testing method of beam diameter of laser radiation  
31.040 L15 GB/T 13823.18-1997 振动与冲击传感器的校准方法 互易法校准 Methods for the calibration of vibration and shock pick-ups primary vibration calibration by reciprocity method IDT ISO/DIS 5347-20:1989
31.260 L90 GB/T 13842-1992 掺钕钇铝石榴石激光棒 Neodymium-doped yttrium aluminum garnet laser rods  
31.260 L51 GB/T 13863-1992 激光辐射功率测试方法 Testing method for laser radiant power  
31.260 L51 GB/T 13864-1992 激光辐射功率稳定度测试方法 Testing method for laser radiant power stability  
31.060.70 N22 GB/T 13865-1992 电力定量器 Instrument for electric load control NEQ IEC/TC13 1006号文件
31.120 L39 GB/T 13943-1992 荧光显示管总规范(可供认证用) General specification for vacuum fluorescent display tubes  
31.120 L39 GB/T 13944-1992 荧光显示管空白详细规范(可供认证用) Blank detail specification for vacuum fluorescent display tubes  
31.120 L39 GB/T 13945-1992 辉光放电显示管总规范(可供认证用) General specification for glow discharge display tubes  
31.120 L39 GB/T 13946-1992 辉光放电显示管空白详细规范(可供认证用) Blank detail specification for glow discharge display tubes  
31.020 L99 GB/T 13947-1992 电子元器件塑料封装设备通用技术条件 General specification for electronic components plastic packaging equipments  
31.020 N04 GB/T 13965-1992 仪表元器件术语 Instrument components--Vocabulary  
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.060 L11 GB/T 14004-1992 电子设备用固定电容器 第六部分: 分规范 金属化聚碳酸酯膜介质直流固定电容器(可供认证用) Fixed capacitors for use in electronic equipment--Part 6: Sectional specification Fixed metallized polycarbonate film dielectric d.c. capacitors IDT IEC 60384-6-87
31.060.30 L11 GB/T 14005-1992 电子设备用固定电容器 第六部分: 空白详细规范 金属化聚碳酸酯膜介质直流固定电容器 评定水平 E(可供认证用) Fixed capacitors for use in electronic equipment--Part 6: Blank detail specification--Fixed metallized polycarbonate film dielectric d.c. capacitors--assessment level E IDT IEC 60384-6-1
31.120 L38 GB/T 14010-1992 阴极射线管玻壳试验方法 Methods of test for cathode-ray tube bulbs  
31.120 L38 GB/T 14011-1992 阴极射线管X射线辐射测试方法 Methods of measurement of X-radiation for cathode-ray tubes  
31.120 L38 GB/T 14012-1992 K白显象管玻壳总规范 (可供认证用) Generial specification for black-and-white picture tube bulbs  
31.200 K52 GB/T 14024-1992 内燃机电站无线电干扰特性的测量方法及允许值 传导干扰 Limits and methods of measurement of radio interference characteristics of electric power plant with internal combustion engines--Conducted interference NEQ IEC 60533
31.200 L56 GB/T 14025-1992 半导体集成电路门阵列电路系列和品种 ECL系列的品种 Series and products for semiconductor gate array integrated circuits--Products of series ECL  
31.200 L56 GB/T 14026-1992 半导体集成电路微型计算机电路系列和品种80C86系列的品种 semiconductor integrated circuits--Products of 80C86 family  
31.200 L56 GB/T 14027.1-1992 半导体集成电路通信电路系列和品种 有源滤波器系列品种 Series and products of communication circuits for semiconductor integrated circuits--Products of active filters  
31.200 L56 GB/T 14027.2-1992 半导体集成电路通信电路系列和品种 脉码调制编译码器系列品种 Series and products of communication circuits for semiconductor integrated circuits--Products of PCM coder-decoders  
31.200 L56 GB/T 14027.3-1992 半导体集成电路通信电路系列和品种 模拟开关阵列系列品种 Series and products of communication circuits for semiconductor integrated circuits--Products of analogue switch arraies  
31.200 L56 GB/T 14027.4-1992 半导体集成电路通信电路系列和品种 双音多频电路系列品种 Series and products of communication circuits for semiconductor integrated circuits--Products of dual-tone multi-frequency circuits  
31.200 L56 GB/T 14027.5-1992 半导体集成电路通信电路系列和品种 电话电路系列品种 Series and products of communication circuits for semiconductor integrated circuits--Products of telephone circuits  
31.200 L56 GB/T 14027.6-1992 半导体集成电路通信电路系列和品种 频率合成器系列品种 Series and products of communication circuits for semiconductor integrated circuits--Products of frequency synthesizers  
31.200 L56 GB/T 14027.7-1992 半导体集成电路通信电路系列和品种 数字交换系统接口电路系列品种 Series and products of communication circuits for semiconductor integrated circuits--Products of digital switching system interface circuits  
31.200 L55 GB/T 14028-1992 半导体集成电路模拟开关测试方法的基本原理 General principles of measuring methods of analogue switches for semiconductor integrated circuits  
31.200 L55 GB/T 14029-1992 半导体集成电路模拟乘法器测试方法的基本原理 General principles of measuring methods of analogue multiplier for semiconductor integrated circuits  
31.200 L55 GB/T 14030-1992 半导体集成电路时基电路测试方法的基本原理 General principles of measuring methods of timer circuits for semiconductor integrated circuits  
31.200 L55 GB/T 14031-1992 半导体集成电路模拟锁相环测试方法的基本原理 General principles of measuring methods of analogue phase-loop for semiconductor integrated circuits  
31.200 L55 GB/T 14032-1992 半导体集成电路数字锁相环测试方法的基本原理 General principles of measuring methods of digital phase-locked loop for semiconductor integrated circuits  
31.260 L48 GB/T 14078-1993 氦氖激光器技术条件 He-Ne laser specification  
31.100 L39 GB/T 14110-1993 闸流管与充气整流管总规范 (可供认证用) General specification for thyratrons and gas-filled rectifier tubes  
31.100 L39 GB/T 14111-1993 闸流管与充气整流管空白详细规范 (可供认证用) Blank detail specification for thyratorns and gas-filled rectifier tubes  
31.200 L55 GB/T 14112-1993 半导体集成电路 塑料双列封装冲制型引线框架规范 Semiconductor integrated circuits--Specification for stamped leadframes of plastic DIP NEQ SEMI G9、G10-86
31.200 L55 GB/T 14113-1993 半导体集成电路封装术语 Terminology of packages for semiconductor integrated circuits NEQ SEMI G9
31.200 L56 GB/T 14114-1993 半导体集成电路电压/频率和频率/电压转换器测试方法的基本原理 General principles of measuring methods of V/F and F/V converters for semiconductor integrated circuits  
31.200 L56 GB/T 14115-1993 半导体集成电路采样/保持放大器测试方法的基本原理 General principles of measuring methods of Sample/Hold amplifiers for semiconductor integrated circuits  
31.120 L49 GB/T 14116-1993 彩色液晶显示器件的光度和色度的测试方法 Photomentric and colorimetric methods of measurement of color liquid crystal displays NEQ IEC 60441(1974)
31.120 L49 GB/T 14117-1993 彩色液晶显示器件空白详细规范 (可供认证用) Blank detail specification of color liquid crystal displays  
31.200 L56 GB/T 14119-1993 半导体集成电路双极熔丝式可编程只读存储器空白详细规范(可供认证用) Blank detail specification for semiconductor integrated circuit fusible-link programmable bipolar read-only memories NEQ IEC TC47A(Co)
31.020 L22 GB/T 14120-1993 单孔轴套安装、轴控电子元件的安装尺寸 Dimensions for the mounting of single-hole, bush-mounted, spendle-operated electronic components  
31.060.40 L11 GB/T 14121-1993 电子设备用固定电容器 第3 部分: 分规范 片状钽固定电容器(可供认证用) Fixed capacitors for use in electronic equipment--Part 3: Sectional specification--Fixed tantalum chip capacitors IDT IEC 60384-3-89
31.060.40 L11 GB/T 14122-1993 电子设备用固定电容器 第3 部分: 空白详细规范 片状钽固定电容器 评定水平 E(可供认证用) Fixed capacitors for use in electronic equipment--Part 3: Blank detail specification:chip capacitors--Assessment level E IDT IEC 60384-3
31.120 L32 GB/T 14126-1993 显示管防眩玻屏技术要求及试验方法 Technical requirement and test method for the non-glare display glass tube  
31.260 L32 GB/T 14128-1993 掺铷钇铝石榴石激光棒尺寸系列 Dimension series for neodymium-doped yttrium aluminum garnet laser rods  
31.200 L56 GB/T 14129-1993 半导体集成电路TTL电路系列和品种 PAL系列的品种 Series and products for TTL semiconductor integrated circuits--Products of series PAL  
31.120 L39 GB/T 14182-1993 变像管和像强管总规范(可供认证用) Generic specification for image-converter tubes and image intensifier tubes EQV CECC 12000
31.120 L39 GB/T 14183-1993 变像管和像强管空白详细规范(可供认证用) Blank detail specification for image-converter tubes and image intensifier tubes EQV CECC 12000
31.120 L39 GB/T 14184-1993 变像管和像强管测试方法 The methods of measurement for image-converter tubes and image intensifier tubes EQV CECC 12000
31.100 L39 GB/T 14186-1993 充气稳压管总规范(可供认证用) Generic specification for gas-filled voltage Stabilizing tubes  
31.060.30 Y32 GB/T 14217-1993 电容器纸介质损耗因数(tanδ)测定法 Method of test for dielectric dissipation factor (tanδ) of capacitor paper at power frequence NEQ IEC 60554
31.020 L04 GB/T 14278-1993 电子设备热设计术语 Terms for thermal design of electronic equipment  
31.120 L39 GB/T 14279-1993 交流等离子体显示器件空白详细规范(可供认证用) Blank detail specification for AC plasma display devices  
31.060.30 L11 GB/T 14472-1998 电子设备用固定电容器 第14部分: 分规范 抑制电源电磁干扰用固定电容器 Fixed capacitors for use in electronic equipment--Part 14: Sectional specification: Fixed capacitors for electromagnetic interference suppression and connection to the supply mains IDT IEC 60384-14:1993
31.060.30 L11 GB/T 14473-1998 电子设备用固定电容器 第14部分: 空白详细规范 抑制电源电磁干扰用固定电容器 评定水平D Fixed capacitors for use in electronic equipment--Part: 14 Blank detail specification--Fixed capacitors for electromagnetic interference suppression and connection to the supply mains--Assessment level D IDT IEC 60384-14-1:1993
31.180 L39 GB/T 14515-1993 有贯穿连接的单、双面挠性印制板技术条件 Specification for single and double sided flexible printed boards with through connections NEQ IEC 60326-8
31.180 L39 GB/T 14516-1993 无贯穿连接的单、双面挠性印制板技术条件 Specification for single and double sided flexible printed boards without through connections NEQ IEC 60326-7
31.060.30 L11 GB/T 14579-1993 电子设备用固定电容器 第17部分: 分规范 金属化聚丙烯膜介质交流和脉冲固定电容器 Fixed capacitors for use in electronic equipment--Part 17: Sectional specification--Fixed metallized polypropylene film dielectric a.c and pulse capacitors IDT IEC 60384-17
31.060.30 L11 GB/T 14580-1993 电子设备用固定电容器 第17部分: 空白详细规范 金属化聚丙烯膜介质交流和脉冲固定电容器 评定水平E Fixed capacitors for use in electronic equipment--part 17: Blank detail specification--Fixed metallized polypropylene film dielectric a.c and pulse capacitors--Assessment level E IDT IEC 60384-17-1
31.200 L32 GB/T 14619-1993 厚膜集成电路用氧化铝陶瓷基片 Alumina ceramic substrates for thick film integrated circuits  
31.200 L32 GB/T 14620-1993 薄膜集成电路用氧化铝陶瓷基片 Alumina ceramic substrates for thin film integrated circuits  
31.180 L30 GB/T 14708-1993 挠性印制电路用涂胶聚酯薄膜 Adhesive coated polyester film for flexible printed circuits NEQ BS 4548第15部分
31.180 L30 GB/T 14709-1993 挠性印制电路用涂胶聚酰亚胺薄膜 Adhesive coated polyimide film for flexible printed circuits NEQ BS 4548
31.120 M73 GB/T 14858-1993 K白监视器通用技术条件 General specification for black-white monitors  
31.200 L55 GB/T 14862-1993 半导体集成电路封装结到外壳热阻测试方法 Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits NEQ SEMI G30-86,G43-87
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.140 L21 GB/T 15020-1994 电子设备用石英晶体元件 空白详细规范 电阻焊石英晶体元件 评定水平 E Quartz crystal units for use in electronic equipment--Blanr detail specification--Resistance welded quartz crystal units--Assessment level E  
31.200 L56 GB/T 15136-1994 半导体集成电路石英钟表电路测试方法的基本原理 General principles of measuring methods for quartz clock and watch circuits of semiconductor integrated circuits  
31.080.10 L41 GB/T 15137-1994 体效应二极管空白详细规范 Blank detail specification for gunn diodes  
31.200 L55 GB/T 15138-1994 膜集成电路和混合集成电路外形尺寸 Case outlines for film integrated circuits and hybrid integrated circuits  
31.140 L21 GB/T 15156-1994 压电陶瓷换能元件总规范 Generic specification for piezoelectric ceramic transducing elements  
31.220.10 L23 GB/T 15157-1994 印制板用频率低于3MHz的连接器 第1 部分: 总规范 一般要求和编制有质量评定的详细规范的导则 Connectors for frequencies below 3MHz for use with printed boards--Part l: Generic specification--General requirements and guide for the preparation of detail specifications, with assessed quality IDT IEC 60603-1-92(E)
31.220.10 L23 GB/T 15157.2-1998 印制板用频率低于3MHz的连接器 第2部分: 有质量评定的具有通用安装特征 基本网格2.54mm(0.1in)的印制板用两件式连接器详细规范 Connectors for frequencies below 3MHz for use with printed boards--Part 2: Detail specification for two-part connectors with assessed quality,for printed boards,for basic grid of 2.54mm(0.1in) with commonmounting features IDT IEC 60603-2:1995
31.260 L47 GB/T 15167-1994 半导体激光光源总规范 General specification for light source of semiconductor lasers  
31.260 L51 GB/T 15175-1994 固体激光器主要参数测试方 Measurement methods for main parameter of solid-state lasers  
31.220.10 L24 GB/T 15176-1994 插入式电子元器件用插座及其附件总规范 Generic specification for sockets and accessories for electronic plug-in devices EQV IEC 60149-1
31.080.10 L41 GB/T 15177-1994 微波检波、混频二极管 空白详细规范 Blank detail specification for microwave detectors and mixer diodes  
31.080.10 L41 GB/T 15178-1994 变容二极管空白详细规范 Blank detail specification for variable capacitance diodes  
31.140 H21 GB/T 15250-1994 压电铌酸锂单晶体声波衰减测试方法 Test method for bulk acoustic wave attenuation of piezoelectric lithium niobate crystals  
31.020 L24 GB/T 15286-1994 端接件总规范 General specification for terminals  
31.160 L18 GB/T 15287-1994 抑制射频干扰整件滤波器 第一部分: 总规范 Complete filter units for radio interference suppression--Part 1: Generic specification EQV IEC 60939-1-88
31.160 L18 GB/T 15288-1994 抑制射频干扰整件滤波器 第二部分: 分规范 试验方法的选择和一般要求 Complete filter units for radio interference suppression--Part 2: Sectional specification--Selection of methods of test and general requirements EQV IEC 60939-2-88
31.080.20 K46 GB/T 15291-1994 半导体器件 第6部分 晶闸管 Semiconductor devices--Part 6: Thyristors EQV IEC 60747-6-83
31.080.20 K46 GB/T 15292-1994 晶闸管测试方法 逆导三极晶闸管 Measuring methods for thyristor--Reverse conducting triode thyristor EQV IEC 60747-6-83
31.080.20 K46 GB/T 15293-1994 晶闸管测试方法 可关断晶闸管 Measuring methods for thyristor--Gate turn-off thyristor EQV IEC 60747-6-83
31.200 L55 GB/T 15297-1994 微电路模块机械和气候试验方法 Mechanical and climatic test methods for microcircuit modules  
31.040.20 L14 GB/T 15298-1994 电子设备用电位器 第一部分: 总规范 Potentiometers for use in electronic equipment--Part 1: Generic specification IDT IEC 60393-1-89
31.040.20 L14 GB/T 15299-1994 电子设备用电位器 第二部分: 分规范 螺杆驱动和旋转预调电位器 Potentiometers for use in electronic equipment--Part 2: Sectional specification--Lead-screw actuated and rotary preset potentiometers IDT IEC 60393-2-89
31.040.20 L14 GB/T 15300-1994 电子设备用电位器 第二部分: 空白详细规范 螺杆驱动和旋转预调电位器 评定水平 E Potentiometers for use in electronic equipment--Part 2: Blank detail specification--Lead-screw actuated and rotary preset potentiometers--Assessment level E IDT IEC 60393-2-1-89
31.260 L39 GB/T 15301-1994 气体激光器总规范 General specification for gas lasers  
31.260 N04 GB/T 15313-1994 激光术语 Terminology for laser  
31.240 L97 GB/T 15394-1994 多探针测试台通用技术条件 General specification for probe tester  
31.240 M05 GB/T 15395-1994 电子设备机柜通用技术条件 General technical specification for cabinet of electronic equipment  
31.100 L36 GB/T 15426-1994 收讯放大电子管空白详细规范 Blank detail specification for receiving tubes  
31.120 L38 GB/T 15427-1994 彩色显示管测试方法 Methods of measurement of colour display tubes  
31.060.30? L11 GB/T 15448-1995 电子设备用固定电容器 第19部分: 分规范 金属化聚乙烯对苯二甲酸酯膜介质直流片式固定电容器 Fixed capacitors for use in electronic equipment--Part 19: Sectional specification-- Fixed metallized polyethylene-terephthalate film dielectric chip D.C.capacitors IDT IEC 60384-19-1993
31.080.30? L44 GB/T 15450-1995 硅双栅场效应晶体管 空白详细规范 Blank detail specification for silicon dual-gate field-effect transistors IDT IEC 60747-8-1
31.220.20 L22 GB/T 15461-1995 电子设备用机电开关 第3部分: 成列直插封装式开关分规范 Electromechanical switches for use in electronic equipments--Part 3: Sectional specification for in-line package switches IDT IEC 61020-3-91
31.220.20 L22 GB/T 15462-1995 电子设备用机电开关 第3-1部分: 成列直插封装式开关 空白详细规范 Electromechanical switches for use in electronic equipments--Part 3-1: Blank detail specification for in-line package switches IDT IEC 61020-3-1-91
31.220.10? M64 GB/T 15644-1995 视听系统设备互连用连接器的应用 Application of connectors for the interconnection of equipment in audio-visual systems NEQ IEC 60574-3-1983
31.260? L40 GB/T 15651-1995 半导体器件 分立器件和集成电路 第5部分:光电子器件 Semiconductor devices--Discrete devices and integrated circuits--Part 5: Optoelectronic devices IDT IEC 60747-5-1992
31.040.30? L15 GB/T 15652-1995 金属氧化物半导体气敏元件总规范 Generic specification for gas sensors of metal-oxide semiconductor NEQ IEC 60738-1
31.040? L13 GB/T 15654-1995 电子设备用膜固定电阻网络 第1部分:总规范 Fixed film resistor networks for use in electronic equipment--Part 1: Generic specification IDT IEC 61045-1-1991
31.020 L15 GB/T 15768-1995 电容式湿敏元件与湿度传感器总规范 General specification for the capacitance type humidity sensor and transducer NEQ JIS Z 8806-1981
31.200 L97 GB/T 15861-1995 离子束蚀刻机通用技术条件 Generic specification of ion beam etching system  
31.200 L97 GB/T 15862-1995 离子注入机通用技术条件 Generic specification for ion implantation equipment  
31.030 L97 GB/T 15870-1995 硬面光掩模用铬薄膜 Chrome thin films for hard surface photomasks EQV SEMI P2-86
31.030 L97 GB/T 15871-1995 硬面光掩模基板 Hard surface photomask substrates NEQ SEMI P1-92
31.220.10 L97 GB/T 15872-1995 半导体设备电源接口 Power supply interface for semiconductor equipment NEQ SEMI E7-92
31.220.10 L97 GB/T 15873-1995 半导体设施接口技术文件编写导则 Directives for drafting semiconductor facilities interface specification NEQ SEMI E6-92
31.200 L55 GB/T 15876-1995 塑料四面引线扁平封装引线框架规范 Specification of leadframes for plastic quad flat package NEQ SEMI G47-88
31.200 L55 GB/T 15877-1995 蚀刻型双列封装引线框架规范 Specification of DIP leadframes produced by etching NEQ SEMI G 19-84
31.200 L55 GB/T 15878-1995 小外形封装引线框架规范 Specification of leadframes for small outline package NEQ SEMI G 28-86
31.200 L55 GB/T 15879-1995 半导体器件的机械标准化 第5部分: 用于集成电路载带自动焊(TAB)的推荐值 Mechanical standardization of semiconductor devices--Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits IDT IEC 60191-5-87
31.040.20 L14 GB/T 15880-1995 电子设备用电位器 第3部分: 分规范 旋转式精密电位器 Potentiometers for use in electronic equipment--Part 3: Sectional specification:Rotary precision potentiometers IDT IEC 60393-3-92
31.040.20 L14 GB/T 15881-1995 电子设备用电位器 第3部分: 空白详细规范 旋转式精密电位器 评定水平E Potentiometers for use in electronic equipment--Part 3: Blank detail specification:Rotary precision potentiometers Assessment level E IDT IEC 60393-3-1-92
31.040 L13 GB/T 15882-1995 电子设备用膜固定电阻网络 第2部分: 按能力批准程序评定质量的膜电阻网络分规范 Fixed film resistor networks for use in electronic equipment--Part 2: Sectional specification for film resistor networks of assessed quality on the basis of the capability approval procedure IDT IEC 61045-2-91
31.040.10 L13 GB/T 15883-1995 电子设备用膜固定电阻网络 第2部分: 按能力批准程序评定质量的膜电阻网络空白详细规范 评定水平E Fixed film resistor networks for use in electronic equipment--Part 2: Blank detail specification for film resistor networks of assessed quality on the basis of the capability approval procedure--Assessment level E IDT IEC 61045-2-1-91
31.040.10 L13 GB/T 15884-1995 电子设备用固定电阻器 第5部分: 空白详细规范: 精密固定电阻器 评定水平 F Fixed resistors for use in electronic equipment--Part 5: Blank detail specification:Fixed precision resistors--Assessment level F IDT IEC 60115-5-2-92
31.040.10 L13 GB/T 15885-1995 电子设备用固定电阻器 第4部分: 空白详细规范: 功率型固定电阻器 评定水平 F Fixed resistors for use in electronic equipment--Part 4: Blank detail specification:Fixed power resistors--Assessment level F IDT IEC 60115-4-2-92
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.180 L30 GB/T 16261-1996 印制板总规范 Generic specification printed boards IDT IEC/PQC 88-1990
31.140 L18 GB/T 16304-1996 压电陶瓷电场 应变特性测试方法 Test methods of the properties of the relation between strain and electric field for piezoelectric ceramic  
31.180 L30 GB/T 16315-1996 印制电路用限定燃烧性的覆铜箔聚酰亚胺玻璃布层压板 Polyimide woven glass fabric copper-clad laminated sheet of defined flammability for printed circuits NEQ IEC 60249-2-1993
31.180 L30 GB/T 16317-1996 多层印制电路用限定燃烧性的薄覆铜箔聚酰亚胺玻璃布层压板 Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards NEQ IEC 60249-2-1992
31.200 L55 GB/T 16465-1996 膜集成电路和混合膜集成电路分规范(采用能力批准程序〕 Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures IDT IEC 60748-22-1992
31.200 L55 GB/T 16464-1996 半导体器件 集成电路 第1部分: 总则 Semiconductor devices integrated circuits--Part 1: General IDT IEC 60748-1-1984
31.200 L55 GB/T 16466-1996 膜集成电路和混合膜集成电路空白详细规范(采用能力批准程序〕 Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures IDT IEC 60748-22-1-1991
31.060.30 L11 GB/T 16467-1996 电子设备用固定电容器 第19部分: 空白详细规范 金属化聚乙烯对苯二甲酸酯膜介质 直流片式固定电容器 评定水平E Fixed capacitora for use in electronic equipment--Part 19: Blank detail specification--Fixed metallized polyethylene-terephthalate film dielectric chip d.c.capacitors--Assessment level E IDT IEC 60384-19-1-1993
31.080.29 L44 GB/T 16468-1996 静电感应晶体管系列型谱 Series programmes for static induction transistors  
31.020 L19 GB/T 16512-1996 抑制射频干扰固定电感器 第1部分 总规范 Fixed inductors for radio interference suppression--Part 1: Generic specification IDT IEC 60938-1-1988
31.020 L19 GB/T 16513-1996 抑制射频干扰固定电感器 第2部分 分规范 试验方法和一般要求的选择 Fixed inductors for radio interference suppression--Part 2: Sectional specification--Selection of methods of test and gederal requirements IDT IEC 60938-2-1988
31.040.20 L14 GB/T 16515-1996 电子设备用电位器 第5部分: 分规范 单圈旋转式低功率线绕和非线绕电位器 Potentiometers for use in electronic equipment--Part 5: Sectional specification: Single-turn rotary low-power wirewound and non-wirewound potentiometers IDT IEC 60393-5-1992
31.020 L21 GB/T 16516-1996 石英晶体元件 电子器件质量评定体系规范 第2部分: 分规范能力批准 Quartz crystal units--A specification in the quality assessment system for electronic components--Part 2: Sectional specification--Capability approval IDT IEC 601178-2-1993
31.020 L21 GB/T 16517-1996 石英晶体元件 电子元器件质量评定体系规范 第3部分: 分规范 鉴定批准 Quartz crystal units--A specification in the quality assessment system for electronic components--Part 3: Sectional specification--Qualification approval IDT IEC 61178-3-1993
31.200 L90 GB/T 16523-1996 圆形石英玻璃光掩模基板规范 Specification for round quartz photomask substrates EQV SEMI P4-92
31.200 L95 GB/T 16524-1996 光掩模对准标记规范 Specification for registration marks for photomasks EQV SEMI P6-88
31.200 L55 GB/T 16525-1996 塑料有引线片式载体封装引线框架规范 Specification of leadframes for plastic leaded chip carrier packages EQV SEMI G27-89
31.200 L55 GB/T 16526-1996 封装引线间电容和引线负载电容测试方法 The method of measuring the lead-to-lead and loading capacitance of package leads EQV SEMI G24-89
31.200 L90 GB/T 16527-1996 硬面感光板中光致抗蚀剂和电子束抗蚀剂规范 Specification for photoresist/E-beam resist for hard surface photoplates EQV SEMI P3-90
31.030 L95 GB/T 16528-1996 压敏电阻器用氧化锌陶瓷材料 Zinc oxide ceramics for use in varistors  
31.260 L51 GB/T 16530-1996 单模纤维光学器件回波损耗偏振依赖性测量方法 Measuring method for polarization dependence of return loss of a single-mode fibre optic component IDT IEC/DIS 61300-3-19
31.020 L90 GB/T 16822-1997 介电晶体介电性能的试验方法 Test method for dielectric properties of dielectric crystal  
31.200 L97 GB/T 16878-1997 用于集成电路制造技术的检测图形单元规范 Specification for metrology pattern cells for integrated circuit manufacture IDT SEMI P19:1992
31.020 L97 GB/T 16879-1997 掩模曝光系统精密度和准确度的表示准则 Guidelines for precision and accuracy expression for mask writing equipment IDT SEMI P21:1992
31.020 L97 GB/T 16880-1997 光掩模缺陷分类和尺寸定义的准则 Guidelines for photomask defect classification and size definition IDT SEMI P22:1993
31.080.10 K46 GB/T 16894-1997 大于100A,环境和管壳额定的整流二极管(包括雪崩整流二极管)空白详细规范 Blank detail specification for rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, for currents greater than 100A IDT IEC 60747-2-2:1993
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.080.30 K46 GB/T 17007-1997 绝缘栅双极型晶体管测试方法 Measuring methods for insulated-gate bipolar transistor  
31.080.30 K46 GB/T 17008-1997 绝缘栅双极型晶体管的词汇及文字符号 Terminology and letter symbols for insulated-gate bipolar transistor EQV IEC/TC 47(CO)1339
31.200 L55 GB/T 17023-1997 半导体器件 集成电路 第2部分: 数字集成电路 第二篇HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范 Semiconductor devices integrated circuits--Part 2: Digital Integrated circuits Section two--Family specification for HCMOS digital integrated circuits,series 54/74HC,54/74HCT,54/74HCU IDT IEC 60748-2-2:1992
31.200 L55 GB/T 17024-1997 半导体器件 集成电路 第2部分: 数字集成电路 第三篇HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 Semiconductor devices integrated circuits--Part2: Digital Integrated circuits Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU IDT IEC 60748-2-3l:1992
31.040.20 L14 GB/T 17025-1997 电子设备用电位器 第4部分: 分规范 单圈旋转功率电位器 Potentiometers for use in electronic equipment Part 4--Sectional specification: Single-turn rotary power potentiometers IDT IEC 60393-4:1992
31.040.20 L14 GB/T 17026-1997 电子设备用电位器 第4部分: 空白详细规范 单圈旋转功率电位器 评定水平E Potentiometers for use in electronic equipment Part 4: Blank detail specification Single-turn rotary power potentiometers--Assessment level E IDT IEC 60393-4-1:1992
31.040.20 L14 GB/T 17027-1997 电子设备用电位器 第4部分: 空白详细规范: 单圈旋转功率电位器 评定水平F Potentiometers for use in electronic equipment Part 4: Blank detail specification--Single-turn rotary power potentiometers Assessment level F IDT IEC 60393-4-2:1992
31.040.20 L14 GB/T 17028-1997 电子设备用电位器 第5部分: 空白详细规范 单圈旋转低功率电位器 评定水平E Potentiometers for use in electronic equipment Part 5: Blank detail specification--Single-turn rotary low-power potentiometers Assessment level E IDT IEC 60393-5-1:1992
31.040.20 L14 GB/T 17029-1997 电子设备用电位器 第5部分: 空白详细规范: 单圈旋转低功率电位器 评定水平F Potentiometers for use in electronic equipment Part 5: Blank detail specification--Single-turn rotary low-power potentiometers Assessment level F IDT IEC 60393-5-2:1992
31.040.10 L13 GB/T 17034-1997 电子设备用固定电阻器 第2部分: 空白详细规范 低功率非线绕固定电阻器 评定水平F Fixed resistors for use in electronic equipment Part 2: Blank detail specification Fixed low-power non-wirewound resistors Assessment level F IDT IEC 60115-2-2:1992
31.040.10 L13 GB/T 17035-1997 电子设备用固定电阻器 第4部分: 空白详细规范 带散热器的功率型固定电阻器 评定水平H Fixed resistors for use in electronic equipment--Part 4: Blank detail specification--Fixed power resistors, heat-sink types--Assessment level H IDT IEC 60115-4-3:1993
31.160 L18 GB/T 17190-1997 电子设备用压电陶瓷滤波器 电子元器件质量评定体系规范 第1部分: 总规范 鉴定批准 Piezoelectric ceramic filters for use in electronic equipment A specification in the quality assessment system for electronic components-Part 1: Generic specification--Qualification approval IDT IEC 61261-1:1994
31.060.50 L11 GB/T 17206-1998 电子设备用固定电容器第18部分: 分规范 固体(MnO2)与非固体电解质片式铝固定电容器 Fixed capacitors for use in electronic equipment--Part 18: Sectional specification: Fixed aluminium electrolytic chip capacitors with solid (MnO2)and non-solid electrolyte IDT IEC 60384-18:1993
31.060.50 L11 GB/T 17207-1998 电子设备用固定电容 第18部分: 空白详细规范 固体(MnO2)电解质片式铝固定电容器 评定水平E Fixed capacitors for use in electronic equipment--Part 18: Blank detail specification--Fixed aluminium electrolytic chip capacitors with solid (MnO2)electrolyte--Assessmentlevel E IDT IEC 60384-18-1:1993
31.060.50 L11 GB/T 17208-1998 电子设备用固定电容器 第18部分: 空白详细规范 非固体电解质片式铝固定电容器 评定水平E Fixed capacitors for use in electronic equipment--Part 18: Blank detail specification--Fixed aluminium electrolytic chip capacitors with non-solid electrolyte--Assessment level E IDT IEC 60384-18-2:1993
31.220.20 L22 GB/T 17209-1998 电子设备用机电开关 第2部分: 旋转开关分规范 Electromechanical switches for use in electronic equipment--Part 2: Sectional specification for rotary switches IDT IEC 61020-2:1991
31.220.20 L22 GB/T 17210-1998 电子设备用机电开关 第2部分: 空白详细规范 旋转开关 Electromechanical switches for use in electronic equipment--Part 2:Blank detail specification: for rotary switches IDT IEC 61020-2-1:1991
31.260 L52 GB/T 17444-1998 红外焦平面阵列特性参数测试技术规范 The technical norms for measurement and test of characteristic parameters of infrared focal plane arrays  
31.220.10 L23 GB/T 17562.1-1998 频率低于3MHz的矩形连接器 第1部分: 总规范--一般要求和编制有质量评定要求的连接器详细规范的导则 Rectangular connectors for frequencies below 3MHz Part 1: Generic specification--General requirements and quide for the preparation of detail specifications,for connectors with assessed quality EQV IEC 60807-1-1991
31.020 K04 GB/T 17564.1-1998 电气元器件的标准数据元素类型和相关分类模式 第1部分: 定义-原则和方法 Standard data element types with associated classification scheme for electric components--Part 1: Detinitions-Principles and methods IDT IEC 61360-1:1995
31.020 K04 GB/T 17564.2-2000 电气元器件的标准数据元素类型和相关分类模式 第2部分: EXPRESS字典模式 Standard data element types with associated classification scheme for electric components Part 2: EXPRESS Dictionary schema IDT IEC 61360-2:1998
31.020 K04 GB/T 17564.3-1999 电气元器件的标准数据元素类型和相关分类模式 第3部分:维护和确认的程序 Standard data element types with associated classification scheme for electric components--Part 3: Maintenance and validation procedures EQV IEC 61360-3:1995
31.020 K04 GB/T 17564.4-2001 电气元器件的标准数据元素类型和相关分类模式 第4部分: IEC标准数据元素类型、元器件类别和项的基准集 Standard data element types with associated classification scheme for electric components--Part 4: IEC reference collection of standard data element types,component classes and terms IDT IEC 61360-4:1997
31.200 L56 GB/T 17572-1998 半导体器件 集成电路 第2部分: 数字集成电路 第四篇工 CMOS数字集成电路 4000B和4000UB系列族规范 Semiconductor devices integratcd circuits Part 2: Digital integrated circuits Section four-Family specification for complementary MOS digital integrated circuits,scrics 4000B and 4000UB IDT IEC 60748-2-4:1992
31.080.01 L40 GB/T 17573-1998 半导体器件 分立器件和集成电路 第1部分: 总则 Semiconductor devices Discrete devices and integrated circuits Part 1: General IDT IEC 60747-1:1983
31.200 L55 GB/T 17574-1998 半导体器件 集成电路 第2部分: 数字集成电路 Semiconductor devices Integrated circuits Part 2: Digital integrated circuits IDT IEC 60748-2:1985
31.060.70 K42 GB/T 17702.1-1999 电力电子电容器 第1部分:总则 Power electronic capacitors--Part 1: General IDT IEC 61071-1:1991
31.060.70 K42 GB/T 17702.2-1999 电力电子电容器 第2部分:熔丝的隔离试验、破坏试验、自愈性试验及耐久性试验的要求 Power electronic capacitors--Part 2: Requirements for disconnecting test on fuses,destruction test,self-healing test and endurance test IDT IEC 61071-2:1994
31.030 L90 GB/T 17711-1999 钇钡铜氧(123相)超导薄膜临界温度Tc的直流电阻试验方法 The DC electric resistance test method for the critical temperature Tc of a YBa2 Cu3O7-δsuperconducting thin film NEQ IEC/TC90 RRR WD-1 Ver.2
31.200 L56 GB/T 17864-1999 关键尺寸(CD)计量方法 CD Metrology procedures IDT SEMI P24:1994
31.200 L56 GB/T 17865-1999 焦深与最佳聚焦的测量规范 Specification for measuring depth of focus and best focus IDT SEMI P25:1994
31.200 L56 GB/T 17866-1999 掩模缺陷检查系统灵敏度分析所用的特制缺陷掩模和评估测量方法准则 Guideline for programmed defect masks and benchmark procedures for sensitivity analysis of mask defect inspection systems IDT SEMI P23:1993
31.060.70 K42 GB/T 17886.1-1999 标称电压1kV及以下交流电力系统用非自愈式并联电容器 第1部分: 总则--性能、试验和定额--安全要求--安装和运行导则 Shunt power capacitors of the non-self--healing type for a.c.systems having a rated voltage up to and including 1kV--Part 1: General--Performance,testing and rating--Safety requirements--Guide for installation and operation IDT IEC 60931-1:1996
31.060.70 K42 GB/T 17886.2-1999 标称电压1kV及以下交流电力系统用非自愈式并联电容器 第2部分: 老化试验和破坏试验 Shunt power capacitors of the non-self-healing type for a.c.systems having a rated voltage up to and including 1kV--Part 2: Ageing test and destruction test IDT IEC 60931-2:1995
31.060.70 K42 GB/T 17886.3-1999 标称电压1kV及以下交流电力系统用非自愈式并联电容器 第3部分: 内部熔丝 Shunt power capacitors of the non-self-healing type for a.c.systems having a rated voltage up to and including 1kV--Part 3: Internal fuses IDT IEC 60931-3:1996
31.200 L56 GB/T 17940-2000 半导体器件 集成电路 第3部分: 模拟集成电路 Semiconductor devices Integrated circuits--Part 3: Analogue integrated circuits IDT IEC 60748-3:1986
ICS
国際規格分類
中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合
31.260 N33 GB 18151-2000 激光防护屏 Laser guards EQV IEC 60825-4:1997
31.180 L30 GB/T 18334-2001 有贯穿连接的挠性多层印制板规范 Specification for flexible multilayer printed boards with through conections IDT IEC 60326-9:1991
31.180 L30 GB/T 18335-2001 有贯穿连接的刚挠多层印制板规范 Specification for flex-rigid multilayer printed boards with through connections IDT IEC 60326-11:1991
31.260 L51 GB/T 18461-2001 激光产品的安全 生产者关于激光辐射安全的检查清单 Safety of laser products--Manufacturer's checklist for radiation safety of laser products EQV IEC 60825-5:1996
31.260 J39 GB/T 18462-2001 激光加工机械 金属切割的性能规范与标准检查程序 Laser processing machines--Performance specifications and benchmarks for cutting of metals EQV ISO/TR 11552:1997
31.260 L51 GB 18490-2001 激光加工机械 安全要求 Laser processing machines--Safety requirements EQV ISO 11553:1996
31.220.20 L22 GB/T 18496-2001 电子设备用机电开关 第4部分: 钮子(倒扳)开关分规范 Electromechanical switches for use in electronic equipment Part 4: Sectional specification for lever(toggle) switches IDT IEC 61020-4:1991
31.200 L56 GB/T 18500.1-2001 半导体器件 集成电路 第4部分: 接口集成电路第一篇: 线性数字/模拟转换器(DAC)空白详细规范 Semiconductor devices Integrated circuits Part 4: Interface integrated circuits Section 1: Blank detail specification for linear digital-to-analogue converters(DAC) IDT IEC 60748-4-1:1993
31.200 L56 GB/T 18500.2-2001 半导体器件 集成电路 第4部分: 接口集成电路第二篇: 线性模拟/数字转换器(ADC)空白详细规范 Semiconductor devices Integrated circuits Part 4: Interface integrated circuits Section 2: Blank detail specification for linear analogue-to-digital converters(ADC) IDT IEC 60748-4-2:1993
31.220.10 L23 GB/T 18501.1-2001 有质量评定的直流和低频模拟及数字式高速数据处理设备用连接器 第1部分: 总规范 Connectors with assessed quality,for use in d.c.,low frequency analogue and in digital high speed data applications--Part 1: Generic specification IDT IEC 61076-1:1995
31.220.10 L23 GB/T 18501.2-2001 直流和低频模拟及数字式高速数据处理设备用连接器 第2部分: 有质量评定的圆形连接器分规范 Connectors for use in d.c.,low-frequency analogue and digital high speed data spplications--Part 2: Circular connectors with assessed quality--Sectional specification IDT IEC 61076-2:1998
31.020 L90 GB/T 18502-2001 银或银合金包套铋系氧化物超导体直流临界电流的测定 The DC critical current measurement for Ag or Ag-alloy sheathed bismuthal oxide superconductor  
ICS
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中国標準分類 規格番号 規格名称(中国語) Top規格名称(英語) 国際整合


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